Semiconductor News & Analysis Feed
608 articles
2026-06-30
digitimes.com
2026-06-30
TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to use a new "round-to-square" architecture to break through cost and capacity bottlenecks in large AI chip packaging and build its next competitive moat.
2026-06-30
digitimes.com
2026-06-30
Qnity, the independent company spun off from US chemicals giant DuPont, is ramping up investment in Taiwan as the island cements its role at the center of the global AI hardware supply chain. Asia-Pacific president Dennis Chen said in an interview with DIGITIMESthat future spending will focus on three main battlegrounds: advanced packaging, co-packaged optics (CPOs), and thermal management.
2026-06-30
digitimes.com
2026-06-30
AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs, tightening capacity across both 8-inch mature processes and 12-inch advanced nodes. CoWoS's advanced packaging and HBM capacity are also set for a prolonged supply shortage, effectively rewriting the foundry industry's business cycle.
2026-06-30
www.tradingview.com
2026-06-30
TradingView
News
/
Zacks
/
ASE Technology vs. Amkor: Which Chip Packaging Stock Is the Better Buy?
ASE Technology vs. Amkor: Which Chip Packaging Stock Is the Better Buy?
5 min read
3711
−4.12%
AMKR
+0.33%
Artificial intelligence (AI) and high-performance computing are driving unprecedented demand for advanced semiconductor packaging, making outsourced semiconductor assembly and test (OSAT) providers increas
2026-06-29
medium.com
2026-06-29
Medium
__fail__
2026-06-29
logisticsbusiness.com
2026-06-29
Logistics Business
More than 160 attendees representing 87 companies across 30 countries gathered at the headquarters of CMC Packaging Automation for CID26 – CMC Innovation Day 2026, the company’s annual event dedicated to innovation in fulfilment automation, systems integration and right-sized packaging.
Built around the theme ‘Ecosystem’, CID26 brought together customers, technology partners, policymakers and ind
2026-06-29
www.kedglobal.com
2026-06-29
KED Global
S.Korea unveils $590 bn chip investment plan for new fabs, packaging
SK Hynix's Icheon Campus in Gyeonggi Province (Courtesy of SK Hynix) South Korea on Monday unveiled a 911 trillion won ($591 billion) semiconductor investment plan spanning new memory fabs in the southwest, an advanced packaging cluster in the Chungcheong region and a supply chain hub in the so
2026-06-29
www.snsinsider.com
2026-06-29
SNS Insider
The Power Module Packaging market is showing significant growth due to an increase in the usage of electric vehicles, implementation of renewable energy, AI-based data centers, and industrial electrification. Power module packaging technology plays an essential part in improving thermal management, reliability, energy density, and energy efficiency of today's power electronics systems. Adoption of
2026-06-29
www.insidermonkey.com
2026-06-29
Insider Monkey
NEWS
Wall Street Firm Says Intel (INTC) Has a Cost Edge Over TSMC in the Advanced Chip Packaging Race
Published on June 29, 2026 at 6:18 am by ABDUL RAHMAN in News
SHARE
Intel Corporation (NASDAQ:INTC) is one of the best fast growth stocks to buy according to hedge funds. On June 26, Goldman Sachs initiated coverage of the stock with a Neutral rating and $150 price target. The firm anticipates fa
2026-06-29
finance.yahoo.com
2026-06-29
Yahoo Finance
Wall Street Firm Says Intel (INTC) Has a Cost Edge Over TSMC in the Advanced Chip Packaging Race
Abdul Rahman
June 29, 2026 2 min read
INTC
+1.54%
2330.TW
-0.81%
Trade Intel on Coinbase
Trading disclosure
Intel Corporation (NASDAQ:INTC) is one of the best fast growth stocks to buy according to hedge funds. On June 26, Goldman Sachs initiated coverage of the stock with a Neutral rating and $150 pr
2026-06-29
eetimes.com
2026-06-29
With HotSat-2 in orbit and fresh funding, U.K. startup SatVu is demonstrating how high-resolution thermal satellite data can reveal real-world industrial activity.
2026-06-29
www.digitaltoday.co.kr
2026-06-29
디지털투데이
Industry
Applied Materials expands packaging equipment lineup to boost HBM, chiplet yields
AI Summary
Applied Materials unveiled six new semiconductor manufacturing tools spanning advanced packaging and DRAM processes, the company said on Sunday. It said AI computing faces a “memory wall” as bandwidth and capacity lag growing model sizes and data throughput, driving demand for high-bandwidth memo
2026-06-29
www.moomoo.com
2026-06-29
Moomoo
To create a seamless experience and for website quality and improvement purposes, we use cookie technologies for verification and quality purposes, to personalize the content presented, and to provide advertising that may be of specific interest to you. Learn our Privacy Policy here.
美光财报碾压预期，更凭千亿美元长单锁定AI内存超级周期。但暴涨后的大跌揭示了市场隐忧：极致定价下，利好即出尽。这千亿订单虽焊死了利润下限，却也给AI牛市的估值天花板戴上了紧箍咒。
6月24日盘后，美光交出了人类存储芯片史上最炸
2026-06-29
biz.chosun.com
2026-06-29
Chosunbiz
By
Jeong Du-yong
Published 2026.06.29. 10:01
The lineup of 3D chip manufacturing equipment for AI semiconductors unveiled by Applied Materials./Courtesy of Applied Materials
Semiconductor equipment corporations Applied Materials unveiled a lineup of 3D chip manufacturing tools for artificial intelligence (AI) semiconductors. The focus is on expanding planarization, deposition and metrology tools
2026-06-29
digitimes.com
2026-06-29
Global revenue for the semiconductor industry's "Foundry 2.0" market reached US$86 billion in the first quarter of 2026, up 23% year-over-year, driven by strong demand for AI accelerators and advanced packaging, according to Counterpoint Research.
2026-06-29
digitimes.com
2026-06-29
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment of a former TSMC executive as an independent director by Chairman Chiang Shang-yi has also drawn industry attention to the commercialization progress of its high-speed optical transceiver business.
2026-06-29
digitimes.com
2026-06-29
Kyocera is committing JPY650 billion (approx. US$4 billion) to its components businesses through fiscal 2031, as AI data center investment and semiconductor equipment spending lift demand for ceramic parts, optical communication packages, and advanced semiconductor packaging materials.
2026-06-28
news.futunn.com
2026-06-28
富途牛牛
__fail__
2026-06-28
digitimes.com
2026-06-28
LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as demand tied to artificial intelligence chips accelerates, Herald Businessreported.
2026-06-28
www.insidermonkey.com
2026-06-28
Insider Monkey
NEWS
Taiwan Semiconductor (TSM), Amkor (AMKR) Form 10-Year Partnership for Advanced Semiconductor Packaging in Arizona
Published on June 27, 2026 at 12:15 pm by MAHAM FATIMA in News
SHARE
Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is one of the best future stocks to buy and hold for 10 years. On June 16, TSMC and Amkor Technology entered into a 10-year partnership to expand adv