Semiconductor News & Analysis Feed
615 articles
2026-06-22
digitimes.com
2026-06-22
TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next several years. Supply chain sources said the first wave of demo equipment has already been installed at VisEra, a TSMC subsidiary.
2026-06-22
digitimes.com
2026-06-22
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies. The appointment also represents another strategic move by Intel CEO Lip-Bu Tan to reorganize the company's foundry business.
2026-06-21
uk.finance.yahoo.com
2026-06-21
Yahoo Finance UK
JPMorgan Sees Growing Fragility in Semiconductor Sector as Positioning Reaches Extremes
Fiona Craig
Sun, 21 June 2026 at 6:00 am GMT-7 1 min read
JPM
+1.92%
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JPMorgan believes the semiconductor sector is becoming increasingly vulnerable to bouts of sharp volatility as investor positioning reaches elevated levels and valuations continue to stretch.
In a research n
2026-06-21
www.ad-hoc-news.de
2026-06-21
AD HOC NEWS
ASML’s, Two-Front
ASML’s Two-Front Challenge: Deflecting a US Smuggling Probe While Managing an EUV Production Squeeze
21.06.2026 - 03:13:29 | boerse-global.de
ASML shares surge 68% YTD on AI demand, but a US smuggling accusation and production constraints pose risks. Analysts remain bullish with price targets up 40%.
ASML’s - ASML’s Two-Front Challenge: Deflecting a US Smuggling Probe While Man
2026-06-21
wccftech.com
2026-06-21
Wccftech
TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage.
The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward.
In a rec
2026-06-21
wccftech.com
2026-06-21
Wccftech
TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage.
The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward.
In a rec
2026-06-20
economictimes.indiatimes.com
2026-06-20
The Economic Times
Synopsis
Intel has appointed former SK hynix and SK On CEO Lee Seok-hee as a senior vice president in its foundry business. Lee will lead advanced packaging and system integration efforts, a crucial area for Intel's push into next-generation AI systems. His extensive experience in high-scale technology and manufacturing is expected to bolster Intel's capabilities and customer commitments in this v
2026-06-20
www.aninews.in
2026-06-20
ANI News
Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging
ANI | Updated: Jun 20, 2026 17:01 IST
Seol [South Korea], June 20 (ANI): Intel has appointed former CEO of SK hynix and SK On Lee Seok-hee as a senior vice president in its foundry business, amid the US chipmaker's push into advanced semiconductor packaging.
According to a report by The Korea Herald, Intel announced Thursd
2026-06-20
www.tekedia.com
2026-06-20
Tekedia
Intel Taps Semiconductor Veteran Seok-Hee Lee To Lead Advanced Packaging Push As Apple Deal Fuels Foundry Ambitions
June 20, 2026 | by Samuel Nwite | 0
Intel has elevated semiconductor industry veteran Seok-Hee Lee to lead its advanced packaging operations, marking the company’s determination to rebuild its manufacturing business and position itself as a major beneficiary of the artificial intel
2026-06-20
www.igorslab.de
2026-06-20
igor´sLAB
INTEL • LATEST NEWS
Intel makes Advanced Packaging its own foundry focus: former SK hynix chief to scale EMIB-T and HBI
20. June 2026 06:00Samir Bashir
📖 Reading time: approx. 7 minutes · 1,308 words · 8,649 characters
A modern AI chip is no longer simply a single piece of silicon. It is a densely packed system of compute chiplets, HBM, I/O dies, networking components, and power delivery. Anyone
2026-06-20
www.igorslab.de
2026-06-20
igor´sLAB
INTEL • LATEST NEWS
Intel makes Advanced Packaging its own foundry focus: former SK hynix chief to scale EMIB-T and HBI
20. June 2026 06:00Samir Bashir
📖 Reading time: approx. 7 minutes · 1,308 words · 8,649 characters
A modern AI chip is no longer simply a single piece of silicon. It is a densely packed system of compute chiplets, HBM, I/O dies, networking components, and power delivery. Anyone
2026-06-19
www.tomshardware.com
2026-06-19
Tom's Hardware
Tech Industry Manufacturing Semiconductors
ASML denies US government report that its EUV chipmaking tool was shipped to China — says 'rumors' are 'inaccurate and damaging to our reputation'
News
By Anton Shilov published June 19, 2026
ASML denies it has ever shipped an EUV scanner to China.
(Image credit: ASML)
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2026-06-19
tomshardware.com
2026-06-19
Luke James
Intel has appointed Seok-Hee Lee, the former chief executive of memory maker SK hynix and battery maker SK On, as executive vice president of Intel Foundry.
2026-06-19
www.tomshardware.com
2026-06-19
Tom's Hardware
Tech Industry
Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company establishing section as 'focused business with dedicated leadership'
News
By Luke James published June 19, 2026
Intel carves back-end packaging into a standalone business.
(Image credit: Getty / Future Publishing)
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2026-06-19
www.thelec.net
2026-06-19
thelec.net
(From left) Lip-Bu Tan, chief executive officer of Intel, and Lee Seok-hee, executive vice president of Intel Foundry. (Photo: Lip-Bu Tan's LinkedIn)
Former SK hynix chief executive officer Lee Seok-hee is returning to Intel, where he will oversee advanced packaging technologies within the company's foundry business.
On June 18, Intel announced through its newsroom that it had appointed Lee as e
2026-06-19
finance.yahoo.com
2026-06-19
Yahoo Finance
Why Amkor Technology (AMKR) Is Up 18.8% After Securing 10-Year TSMC Arizona Packaging Deal
Sasha Jovanovic
Fri, June 19, 2026 at 2:14 AM PDT 3 min read
AMKR
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Trading disclosure
Taiwan Semiconductor Manufacturing Company recently announced a 10-year agreement with Amkor Technology to expand advanced semiconductor packaging and testing capacity in Arizona
2026-06-19
www.koreaherald.com
2026-06-19
The Korea Herald
Lee Seok-hee, executive vice president of Intel Foundry (Intel)
Intel has appointed former CEO of SK hynix and SK On Lee Seok-hee as a senior vice president in its foundry business, amid the US chipmaker’s push into advanced semiconductor packaging.
Intel announced Thursday that Lee will oversee advanced packaging, system integration, back-end technology development and back-end manufacturing at
2026-06-19
cryptobriefing.com
2026-06-19
Crypto Briefing
Intel taps Seok-Hee Lee to lead foundry packaging initiative
The former SK hynix CEO returns to Intel after 15 years to run advanced packaging as a dedicated business unit
2026-06-19
www.benzinga.com
2026-06-19
Benzinga
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2026-06-19
pulse.mk.co.kr
2026-06-19
매일경제
U.S. semiconductor company Intel Corp. has appointed former SK hynix Inc. President Lee Seok-hee as executive vice president of Intel Foundry.
In a press release issued on Thursday, local time, Intel announced that Lee would join the company as executive vice president of its foundry business. He will report directly to Chief Executive Officer (CEO) Lip-Bu Tan.
Lee will oversee advanced packagin