Semiconductor News & Analysis Feed
558 articles
2026-06-17
evertiq.com
2026-06-17
Evertiq
© Wolfspeed
Business | June 17, 2026
GE Aerospace, Wolfspeed to accelerate high-voltage SiC adoption
Evertiq
The companies plan to develop standards for high-voltage silicon carbide power modules, supporting solid-state transformers, industrial electrification and next-generation aerospace & defense platforms while strengthening supply chain resilience.
GE Aerospace and US-based semiconductor com
2026-06-17
news.google.com
2026-06-17
The Korea Herald
2026-06-17
news.google.com
2026-06-17
Moomoo
2026-06-17
digitimes.com
2026-06-17
India-based Kaynes Technology is seeking outsourced automotive semiconductor orders in Japan, a move that could help establish a foothold for Indian backend chip manufacturing in a market long dominated by East Asia. Japanese partners are backing the effort, but the company still faces strict quality hurdles.
2026-06-17
digitimes.com
2026-06-17
The global appetite for AI chips is putting new strain on materials suppliers, turning one of Ajinomoto's lesser-known products into a pressure point for advanced semiconductor packaging.
2026-06-17
eetimes.com
2026-06-17
The June 2026 edition of EE Times Magazine explores autonomous aerospace and defense systems—from orbital data centers to AI-enabled drones.
2026-06-17
news.google.com
2026-06-17
marketplace.org
2026-06-17
www.bizjournals.com
2026-06-17
The Business Journals
www.bizjournals.com
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2026-06-17
news.google.com
2026-06-17
Insider Monkey
2026-06-17
techcrunch.com
2026-06-17
TechCrunch
Qualcomm CEO Cristiano Amon said Tuesday that the company is working on over 40 different AI wearable devices — including jewelry, earbuds with cameras, pins, and watches — a sign of how aggressively the chipmaker is betting that the next major computing platform won’t be a phone.
To power that vision, Qualcomm is announcing two new offerings: a platform called Snapdragon Reality Elite for mixed
2026-06-17
www.sphericalinsights.com
2026-06-17
Spherical Insights
According to market research firm Spherical Insights, which has been working in the semiconductor, advanced packaging, chip manufacturing, artificial intelligence hardware, and electronics supply chain industry for the last 10 years, their market study indicates that the global advanced chip packaging market is experiencing substantial growth and is expected to expand significantly through 2035.
2026-06-17
developer.nvidia.com
2026-06-17
NVIDIA Developer
NVIDIA RTX technologies are deeply integrated into Unreal Engine 5 through the NVIDIA RTX Branch of Unreal Engine and the NVIDIA DLSS Unreal Engine plugin. This provides developers with direct access to advanced rendering, frame generation, and ray-traced lighting. NVIDIA is expanding this integration with new tools for building on-device AI characters and gameplay, as announced at Unreal Fest 202
2026-06-17
www.taipeitimes.com
2026-06-17
Taipei Times
Taiwan Semiconductor Manufacturing Co’s (TSMC, 台積電) American depositary receipts (ADRs) rose over 4 percent in the US overnight, but its spot in the global market capitalization rankings fell one notch to No. 7, according to data released by companiesmarketcap.
The data showed shares in aerospace firm Space Exploration Technologies Corp (SpaceX) jumped almost 20 percent to overtake TSMC for sixth
2026-06-16
militaryembedded.com
2026-06-16
Military Embedded Systems
The next frontier: GaN HEMTs for high-reliability space and defense power architectures
Story
June 16, 2026
BLAKE SOILEAU
Infineon Technologies
Stock image
The space and defense industries face the critical challenge of delivering enhanced compute power in compact, efficient packages without compromising reliability or performance. In defense-related applications, in-orbit computing is the ba
2026-06-16
news.google.com
2026-06-16
CNBC
2026-06-16
www.barrons.com
2026-06-16
Barron's
__fail__
2026-06-16
tomshardware.com
2026-06-16
Andrew E. Freedman
Microsoft is updating the Surface Pro and Surface Laptop using the latest Qualcomm Snapdragon X2 chips, along with haptic feedback on the Laptop's touchpad and a new jade color.
2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
CoPoS may enable larger chips, but CoWoS is still better.
2026-06-16
www.tomshardware.com
2026-06-16
Tom's Hardware
Tech Industry Manufacturing Semiconductors
TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package
News
By Anton Shilov published 16 hours ago
CoPoS may enable larger chips, but CoWoS is still better.
(Image credit: Intel)
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2026-06-16
tomshardware.com
2026-06-16
Hassam Nasir
Intel's cancelled "Arctic Sound" AI GPU based on the original Xe-HP architecture has been pictured sporting two tiles and 32GB of HBM2E.