Semiconductor News & Analysis Feed
4 articles
2026-05-28
digitimes.com
2026-05-28
South Korean AI chip startup FuriosaAI has announced a partnership with Broadcom to develop a next-generation AI inference platform aimed at large-scale agentic AI deployments, as demand grows for infrastructure optimized for AI reasoning and high-volume inference workloads.
2026-05-27
wccftech.com
2026-05-27
Wccftech
FuriosaAI and Broadcom have partnered to build a high-performance AI accelerator chip featuring next-gen HBM4/E memory.
FuriosaAI has announced its third-generation AI accelerator, which builds upon its 2nd Generation RNGD platform, which is currently in mass production on TSMC's 5nm process technology. The 2nd Gen RNGD AI platform comes in the form of a 180W PCIe-based design, which aims at LLM
2026-05-27
www.theregister.com
2026-05-27
The Register
AI+ML
Broadcom's custom ASIC biz adds South Korea's FuriosaAI to its empire
Third-gen chips to use Broadzilla's advanced packaging, networking tech
Tobias Mann
Systems editor
0
Published Wed 27 May 2026 // 13:00 UTC
Broadcom has added FuriosaAI to its list of partners building AI accelerators atop its chip packaging tech.
After years quietly serving as the connective tissue behind many modern
2026-05-27
letsdatascience.com
2026-05-27
Let's Data Science
INFRASTRUCTURE
broadcom
furiosaai
ai accelerators
advanced packaging
Broadcom Adds FuriosaAI for Custom AI Accelerators
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May 27, 2026
6.8
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Broadcom has added South Korea's FuriosaAI to its roster of partners building AI accelerators on Broadcom's packaging and networking technology, The Register reports