www.snsinsider.com
2026-06-23
SNS Insider
The 3D IC market is witnessing tremendous growth because the semiconductor industry is adopting advanced packaging technologies in order to address the escalating needs for better performance, bandwidth, and energy efficiency required for artificial intelligence, HPC, 5G networking, automotive electronics, and consumer devices. Traditional planar chip designs have started facing physical and econo
www.megabites.com.ph
2026-06-08
megabites.com.ph
Cadence and Samsung Foundry announced a full portfolio of Memory and Interface IP, along with expanded certification of Cadence’s agentic AI digital, custom, 3D IC, and system design and analysis (SDA) flows for Samsung Foundry’s second-generation 2nm process. This collaboration delivers a signoff-ready platform for next-generation AI infrastructure and physical AI designs across data center, edge