Cadence and Samsung Foundry Deepen 2nm and 3D IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand - megabites.com.ph

Cadence and Samsung Foundry have deepened their collaboration on 2nm and 3D IC technologies to meet the surging demand for AI infrastructure and physical AI. The expanded partnership enhances Cadence’... Read original →

Samsung Foundry’s intensified collaboration with Cadence on 2nm and 3D IC isn’t just a tech upgrade—it’s a strategic countermove in the AI silicon arms race. This alliance forces upstream suppliers of EUV tools and hybrid bonding materials into overdrive while demanding EDA suites evolve beyond planar design paradigms. Tightening U.S.-Dutch export controls on advanced lithography equipment compel Samsung to diversify 2nm production outside Taiwan, China, inflating capex and yield risks. To undercut TSMC’s CoWoS dominance, Samsung is leveraging open IP frameworks—integrating NVIDIA’s NVLink-C2C—to lure anchor clients like Ambarella. Within 18 months, full-stack 3D IC verification capability will separate EDA leaders from laggards, accelerating consolidation as smaller IP vendors lacking thermal-mechanical co-analysis tools lose relevance.