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Applied Materials unveiled two new chipmaking systems—Centris™ Spectral™ SiN ALD and Producer™ Selectra™ Mo Etch—to address critical challenges in advanced 3D semiconductor manufacturing. As the industry transitions toward gate-all-around (GAA) transistors and high-layer-count 3D NAND due to rising

Applied Materials unveiled two new chipmaking systems—Centris™ Spectral™ SiN ALD and Producer™ Selectra™ Mo Etch—to address critical challenges in advanced 3D semiconductor manufacturing. As the industry transitions toward architectures like gate-all-around (GAA) transistors and high-layer-count 3D