Semiconductor News & Analysis Feed
11357 articles
2026-06-30
digitimes.com
2026-06-30
Micron's latest earnings call pointed to a broader AI shift that could reshape memory demand far beyond data centers, with investors taking note of the company's comments on robots, autonomous vehicles, and other physical systems. The message suggested that the next leg of growth may come from devices that bring AI into the real world.
2026-06-30
digitimes.com
2026-06-30
Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The Bellreported, citing industry sources.
2026-06-30
digitimes.com
2026-06-30
Apple's next iPhone Pro lineup could be heading toward one of its sharpest pricing tests in years, as surging memory costs threaten to raise hardware expenses just as the company pushes deeper into on-device AI.
2026-06-30
digitimes.com
2026-06-30
AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs, tightening capacity across both 8-inch mature processes and 12-inch advanced nodes. CoWoS's advanced packaging and HBM capacity are also set for a prolonged supply shortage, effectively rewriting the foundry industry's business cycle.
2026-06-30
digitimes.com
2026-06-30
Memory pricing pressure continues to intensify. Contract prices have already recorded substantial gains for two consecutive quarters in the first half of 2026. The pace of quarterly increases may now moderate as the pricing base climbs higher. Still, the memory industry remains firmly in a seller's market. Supply constraints have spread beyond high-bandwidth memory (HBM) and premium DRAM products
2026-06-30
digitimes.com
2026-06-30
Arm Holdings says its chip architecture has crossed the 50% threshold in the hyperscale cloud market, a milestone in a segment long dominated by Intel and AMD. The SoftBank-backed chip designer is now pushing further into the hardware business itself, even as supply chains strain under the weight of the AI infrastructure buildout.
2026-06-30
digitimes.com
2026-06-30
South Korea is overhauling its semiconductor manufacturing footprint to secure an edge in the AI era, drawing direct inspiration from a fierce competitor: Taiwan.
2026-06-30
digitimes.com
2026-06-30
Protecting patents around the world is a core value for any R&D-driven company. It is also a commitment to partnering with customers. In 2025, glass giant Corning filed nearly 400 patent applications and close to 1,000 international applications. Its active patent portfolio now totals around 11,400 patents worldwide.
2026-06-30
digitimes.com
2026-06-30
China's silicon carbide (SiC) supply chain is finding a new growth engine as AI strains data-center power systems, extending a market long driven by electric vehicles.
2026-06-30
digitimes.com
2026-06-30
Reports in South Korea that SK Hynix is slowing the pace of converting production lines to sixth-generation high-bandwidth memory, or HBM4, and shifting more capacity toward commodity DRAM have drawn market attention.
2026-06-30
digitimes.com
2026-06-30
Asia Neo Tech has announced a 15-year technology licensing agreement with US-based Brooks Automation to cooperate on FOUP (front-opening unified pod) cleaning equipment and expand its reach into global markets. The two companies held a signing ceremony on June 30, 2026.
2026-06-30
digitimes.com
2026-06-30
SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster timeline by 12 years as it warned that even faster construction will not be enough to meet projected AI memory demand.
2026-06-30
digitimes.com
2026-06-30
Memory price inflation has emerged as one of the biggest challenges facing the consumer electronics industry, with Apple, Microsoft, and Nintendo all having signaled product price increases as widening supply-demand gaps continue to drive up memory costs.
2026-06-30
digitimes.com
2026-06-30
Microcontroller customers are accelerating shipments into the first half of 2026 as higher production costs ripple through the supply chain, with global implications for electronics pricing and availability. Industry sources said buyers are seeking to secure supply before further increases, while weak demand and AI-related capacity pressure continue to shape the market.
2026-06-30
digitimes.com
2026-06-30
Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position. The prospectus highlights its scale in display driver chips and image sensors, while also warning investors about customer concentration, heavy capital needs, and exposure to shifting trade policy.
2026-06-30
digitimes.com
2026-06-30
TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to use a new "round-to-square" architecture to break through cost and capacity bottlenecks in large AI chip packaging and build its next competitive moat.
2026-06-30
digitimes.com
2026-06-30
Japan's world-renowned Riken institute announced in late March 2026 that its homegrown superconducting quantum computer, "Ei-II," jointly developed with the University of Osaka, had officially gone online with 144 qubits and 99.9% fidelity. Taiwan's National Science and Technology Council (NSTC) said Riken will next work with Taiwan's academic community on research, including next-generation compo
2026-06-30
digitimes.com
2026-06-30
For more than a decade, Apple built one of the industry's most profitable business models by using its purchasing power to drive down memory and component costs before turning hardware upgrades into high-margin revenue. The AI-driven boom in HBM and DRAM is now challenging that strategy.
2026-06-30
digitimes.com
2026-06-30
Rumors in Taiwan's capital markets that United Microelectronics Corp. may deepen cooperation with Intel from 12nm to Intel 3 are drawing skepticism from DIGITIMESanalyst Luke Lin. He said the main obstacles are the technology gap and Intel's internal capacity allocation, which make a near-term move commercially difficult.
2026-06-30
digitimes.com
2026-06-30
As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven investment wave is now spreading beyond foundries into the equipment, materials, factory engineering, and inspection supply chains.