1005 articles
2026-05-22
digitimes.com 2026-05-22
Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products, also known as discrete silicon capacitors (IPD), will begin small-volume shipments in the second quarter of 2026, making it the first supplier qualified for Intel's embedded multi-die interconnect bridge (EMIB) advanced
2026-05-22
digitimes.com 2026-05-22
Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through continued investment in its Arizona manufacturing operations.
2026-05-22
digitimes.com 2026-05-22
AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics), underscoring AMD's growing focus on advanced packaging capacity as AI and high-performance computing demand accelerate globally.
2026-05-22
digitimes.com 2026-05-22
AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while also revealing a new strategic direction centered on anelevated fanout bridge(EFB)packaging ecosystem.
2026-05-22
eetimes.com 2026-05-22
AMD to invest more than $10 billion in Taiwan ecosystem, ramping HPC chips on TSMC’s 2-nm process amid AI buildout.
2026-05-21
tomshardware.com 2026-05-21 Anton Shilov
As memory content per rack increases in Vera Rubin platform, it now accounts for nearly 25% of its cost.
2026-05-21
tomshardware.com 2026-05-21 Luke James
The European Commission is preparing to propose a temporary exemption for a Chinese semiconductor manufacturer from the EU's 20th Russia sanctions package.
2026-05-21
tomshardware.com 2026-05-21 Etiido Uko
Employees to receive bonuses in stock and cash
2026-05-21
tomshardware.com 2026-05-21 Zak Killian
Getting banned Hopper or Blackwell chips into mainland data centers just became exponentially more fraught as Taiwan begins to crack down on smugglers.
2026-05-21
tomshardware.com 2026-05-21 Luke James
AMD has announced that its 6th Gen EPYC processor, codenamed Venice, has entered production ramp on TSMC's N2 process in Taiwan.
2026-05-21
tomshardware.com 2026-05-21 Jowi Morales
What will Nintendo do?
2026-05-21
tomshardware.com 2026-05-21 Mark Tyson
The creators of the Flipper Zero “portable multi-tool device for geeks” have announced the Flipper One.
2026-05-21
eetimes.com 2026-05-21
This year’s EE Times Chiplets event will address challenges in the design flow and chiplet technologies to enable straightforward scaling.
2026-05-21
digitimes.com 2026-05-21
China's memory chip industry is entering a critical capital markets phase, with YMTC formally launching IPO counselling and CXMT resuming its STAR Market listing review after updating its prospectus. The parallel moves mark an accelerated push by China's two leading memory chipmakers to secure long-term funding and expand their role in the global semiconductor industry.
2026-05-21
digitimes.com 2026-05-21
During a keynote discussion session at Tech Forum 2026, DIGITIMES senior reporter Monica Chen and semiconductor analyst Andrew Lu shared their views on current AI server technology transformations, concerns over capital expenditure bubbles among global cloud giants, changes in application-specific integrated circuits (ASICs) and chip architectures, and TSMC's global expansion strategy.
2026-05-21
digitimes.com 2026-05-21
SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the back end of the chipmaking process.
2026-05-21
digitimes.com 2026-05-21
LG Innotek has secured substrate supply terms with major technology customers that increasingly resemble long-term agreements used in the memory-chip sector, boosting the South Korean supplier's revenue visibility and reducing profit volatility, according to reports.Hankyungand Yonhap, citing a KB Securities report, said the proposed contracts include large upfront payments, binding multi-year sup
2026-05-21
digitimes.com 2026-05-21
Bloombergreports that Texas Instruments (TI) has sued former vice president Kannan Soundarapandian, alleging he joined GlobalFoundries without fully disclosing his new employer and may bring proprietary power semiconductor knowledge into competitive use. TI is seeking to block his role, arguing it could expose confidential process "recipes, roadmaps, and know-how," with broader implications for co
2026-05-21
digitimes.com 2026-05-21
In a press release on May 20, Japan-based Tokuyama Corporation said it will build a second high-purity isopropyl alcohol plant in Kaohsiung through its joint venture with Formosa Plastics, a move aimed at strengthening global semiconductor supply chains by increasing capacity and quality assurance for electronic manufacturing chemicals and improving stability for customers worldwide through enhanc
2026-05-21
semiengineering.com 2026-05-21 Gregory Haley
Inspection limits, curvilinear adoption, data volumes, and high-NA EUV are converging t...