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US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only after 2028 as the US OSAT ecosystem gradually takes shape.

Samsung Electronics plans to invest VND39 trillion (approx. US$1.5 billion) in a new semiconductor testing facility in northern Vietnam, according to documents reviewed by Reuters,marking the company's first chip testing plant in the country as global memory demand surges amid the AI boom.

Here's one way of solving Nvidia's melting power connectors.

Ubisoft is using an early build of its unannounced Far Cry 7 as a testbed for generative AI tools, according to Tom Henderson of Insider Gaming.

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Multi-die assemblies greatly increase the number of things that can go wrong, and the d...

Testing sooner and more often can improve quality and reduce scrap, but it's also more ...

Copy linkFacebookXWhatsappRedditPinterestFlipboardEmailShare this article4Join the conversationFollow usAdd us as a preferred source on GoogleNewsletterSubscribe to our newsletterShare prices of both Intel and SK hynix have surged following aZDNet Koreareport claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology, with

To secure a foothold in the booming market for advanced AI chip packaging and testing, Taiwan's outsourced semiconductor assembly and test (OSAT) industry is entering what executives and analysts describe as an unprecedented expansion cycle. Industry...The article requires paid subscription.Subscribe Now

Copy linkFacebookXWhatsappRedditPinterestFlipboardEmailShare this article6Join the conversationFollow usAdd us as a preferred source on GoogleNewsletterSubscribe to our newsletterWe took Nvidia's RTX Mega Geometry technology through a series of tests in Alan Wake 2 and the RTX Bonsai Diorama Demo to see how this tech reduces VRAM consumption and eliminates visual artifacts, thus helping pave the w

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