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India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations.

India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they v

Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that would exceed its 2022 peak. The IC substrate and printed circuit board maker announced the strategy at its annual shareholders' meeting at the end of May, citing a shift in demand away from GPUs and CPUs toward ASICs, s

LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC NEWS PROVIDED BY LG Innotek May 27, 2026, 08:00 ET SHARE THIS ARTICLE LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip‑embedding

Home News PR Newswire LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC Provided by PR Newswire May 27, 2026, 8:00:00 PM LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at

Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions Rio Rancho — its New Mexico site — as a global hub for next-generation packaging production.

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Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and...The article requires paid subscription.Subscribe Now