Semiconductor News & Analysis Feed

This article explores how optimizing CPU architecture can enhance efficiency and economic performance in agentic AI systems. As AI factories—interconnected computing ecosystems—gain prominence, their success hinges on efficiently converting power and capital into completed agent tasks. Unlike tradit

In high-performance computing, data transmission bottlenecks have become a critical constraint limiting chip performance advancement. As Moore's Law approaches physical limits, the industry is exploring new technical approaches to address this challenge. Wafer-level architecture and chiplet solution

In the context of the booming artificial intelligence (AI) sector, SK hynix unveiled its next-generation memory technology, 'iHBM,' designed to address the growing challenge of heat generation in high-density semiconductor integration. As AI processing demands increase, HBM has evolved by stacking m

In the context of the booming artificial intelligence (AI) sector, the semiconductor industry faces a major challenge: heat generation in high-density integrated circuits. SK hynix unveiled its next-generation memory technology, 'iHBM,' on May 26, addressing this issue by embedding a proprietary coo