Semiconductor News & Analysis Feed
31 articles
2026-06-05
tomshardware.com
2026-06-05
Jowi Morales
These "makeshift" structures are housing hardware that costs millions of dollars in total.
2026-06-05
news.google.com
2026-06-05
Macworld
2026-06-04
www.semiconductor-today.com
2026-06-04
Semiconductor Today
ROHM’s 750V SiC MOSFET adopted in battery backup unit for AI servers
ROHM says that its 750V silicon carbide (SiC) MOSFET has been adopted in a BBU (battery backup unit) for AI server power supplies. With the rise of generative AI, AI server power systems are shifting to higher voltages and rapidly transitioning to HVDC (high-voltage direct current) architectures. In this environment, ROHM’s devi
2026-06-04
aimagazine.com
2026-06-04
AI Magazine
Dell Technologies has announced an update to the Dell AI Factory, which will see NVIDIA support data processing, retrieval, orchestration and runtime workloads for agentic AI.
The expansion adds Dell PowerEdge servers built with NVIDIA Vera CPUs to what Dell describes as the industry’s broadest AI infrastructure portfolio.
McKinsey estimates there is a US$1tn opportunity for AI in industrial sec
2026-06-04
news.google.com
2026-06-04
GlobeNewswire
2026-06-03
www.stocktitan.net
2026-06-03
Stock Titan
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2026-06-03
www.presseagentur.com
2026-06-03
presseagentur.com
ROHM’s SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance
Willich-Münchheide, Germany, June 03, 2026 – ROHM has announced that its 750 V SiC MOSFET has been adopted in a BBU (Battery Backup Unit) for AI server power supplies. With the rise of generative AI, AI server power systems are shifting to higher voltages and rapidly transitioning to HVDC (high-voltage direct current) a
2026-06-02
finance.yahoo.com
2026-06-02
Yahoo Finance
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2026-06-01
electronics360.globalspec.com
2026-06-01
Electronics360
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2026-06-01
tomshardware.com
2026-06-01
Anton Shilov
Supermicro demonstrates upcoming servers based on AMD’s EPYC ‘Venice’ CPUs, MI450 accelerators, and Nvidia’s Vera Rubin-based solutions.
2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
digitimes.com
2026-05-29
Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa, as the electronics manufacturer looks beyond AI servers for its next phase of growth.
2026-05-29
tomshardware.com
2026-05-29
Jake Roach
Supermicro says it worked directly with Taiwanese authorities on a server smuggling bust that led to the seizure of 50 servers and three arrests.
2026-05-28
www.datacenterdynamics.com
2026-05-28
Data Center Dynamics
AI cloud firm Iren has signed a $1.6bn contract with Dell to acquire air-cooled Blackwell systems.
The hardware will be deployed across Iren's existing data centers in Childress, Texas, to enable the neocloud to meet a five-year $3.4bn AI cloud contract the company signed with Nvidia earlier this month.
– Iren
The contract with Nvidia will see Iren provide the chip designer with access to 60MW
2026-05-27
tomshardware.com
2026-05-27
Jowi Morales
Reports say that the three individuals successfully shipped a batch of banned Nvidia AI chips in Super Micro servers to China from Taiwan to Hong Kong via Japan using falsified documentation.
2026-05-27
digitimes.com
2026-05-27
Kinpo Electronics outlined its 2026 core strategy at a shareholders' meeting on May 25, centering on "bearing fruit" as it builds on years of product-mix adjustments, expands into AI-related products, and accelerates its shift toward an ODM model.
2026-05-26
www.01net.it
2026-05-26
01net
www.01net.it
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2026-05-26
newsroom.st.com
2026-05-26
STMicroelectronics
700V PowerGaN devices improve energy efficiency and enable more compact power designs for AI servers, robotics, industrial systems and advanced consumer applications including home appliances
Alexander Jurman
Technical Media Relations
Tel. +420602748611
alexander.jurman@st.com
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New gallium nitride (GaN)-based power semicondu
2026-05-26
www.morningstar.com
2026-05-26
Morningstar
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2026-05-26
news.google.com
2026-05-26
Business Wire