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2026-09-07
Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV - digitimes
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www.digitimes.com 2026-09-07
2026-09-07
Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV - digitimes
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www.digitimes.com 2026-09-07
Naura Technology's demonstration of selective etching process for 64-layer 3D DRAM structures represents a significant breakthrough for Chinese memory manufacturers facing restricted access to advanced EUV lithography. This development provides domestic semiconductor companies with an alternative pa
3D DRAMEtching ProcessEUV LithographySemiconductor ManufacturingMemory ChipDomestic ReplacementTechnology BreakthroughSemiconductor Equipment
2026-09-07
Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV
0.92
digitimes.com 2026-09-07
2026-09-05
Chinese Chip Making Equipment Firm Naura Claims Big Breakthrough That Could Enable CXMT To Overcome EUV Sanctions & Make 3D DRAM Chips - Wccftech
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wccftech.com 2026-09-05
2026-08-26
China chip equipment maker Naura posts 25% revenue growth, but R&D and margins squeeze profit
0.92
digitimes.com 2026-08-26
2026-06-03
Naura pushes into AI chip packaging with first 600mm PLP descum tool - digitimes
0.85
www.digitimes.com 2026-06-03
Naura Technology Group's launch of its first 600mm × 600mm panel-level packaging descum tool represents a significant breakthrough in China's semiconductor equipment manufacturing capabilities. This advancement marks the company's strategic shift from wafer-level to panel-level packaging, addressing
Semiconductor EquipmentPackaging TechnologyAI Chips600mmPanel-Level PackagingChinese SemiconductorNaura TechnologyChip Manufacturing