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Apple CEO Tim Cook Signals Price Hikes Amid Memory Chip Shortage
Apple CEO Tim Cook Signals Price Hikes Amid Memory Chip Shortage
1 min read
Updated on 18 Jun 2026, 11:45 AM
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Apple CEO Tim Cook has indicated that the company will raise product prices in response to a global memory chip shortage, which
2026-06-18
www.storyboard18.com
2026-06-18
Storyboard18
Apple is preparing to increase prices across its product portfolio as rising memory and storage chip costs put pressure on the company's margins, Chief Executive Officer Tim Cook said in an interview with The Wall Street Journal.
The planned price increase comes as technology companies compete for limited supplies of memory components, with demand from AI-focused data centres pushing costs higher
2026-06-18
www.storyboard18.com
2026-06-18
Storyboard18
Apple is preparing to increase prices across its product portfolio as rising memory and storage chip costs put pressure on the company's margins, Chief Executive Officer Tim Cook said in an interview with The Wall Street Journal.
The planned price increase comes as technology companies compete for limited supplies of memory components, with demand from AI-focused data centres pushing costs higher
2026-06-18
www.gadgets360.com
2026-06-18
Gadgets 360
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2026-06-18
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2026-06-18
mediaselangor.com
2026-06-18
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CUPERTINO, June 17 — Apple plans to raise prices on its products to offset increasing memory and storage chip costs, its chief executive officer Tim Cook told the Wall Street Journal (WSJ) in an interview.
A surge in artificial intelligence (AI)-driven demand for data centres has forced consumer electronics companies into a fierce competition for dwindling supplies of the key components, driving
2026-06-18
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2026-06-18
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2026-06-18
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2026-06-18
Financial Times
IRVINE, Calif. , June 17, 2026 /PRNewswire/ -- Netlist, Inc. (OTCBQ: NLST) today announced it has initiated new legal proceedings against Samsung in the U.S. International Trade Commission (ITC) and the U.S. District Court for the Eastern District of Texas. These actions are based on the infringement of Netlist'sU.S. Patent Nos. 12,646,537 and 12,650,937, which respectively read on Samsung's high
2026-06-18
www.latestly.com
2026-06-18
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Apple outgoing CEO Tim Cook has confirmed that price increases across the company's product lineup are now unavoidable due to the surging costs and tightening supply of memory and storage chips. In an interview with The Wall Street Journal, Cook explained that the situation has become unsustainable, as consumer electronics firms face fierce competition for components that are increasingly being di
2026-06-18
letsdatascience.com
2026-06-18
Let's Data Science
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Apple Signals Price Hikes Amid Memory Chip Shortage
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June 18, 2026
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Apple plans to raise prices on its products to offset soaring memory and storage chip costs, CEO Tim Cook told The Wall Street Journal in an interview published June 17, 2026. Cook sa
2026-06-18
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2026-06-18
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2026-06-18
The Korea Herald
SK hynix's 12-layer HBM4E, the next-generation high-bandwidth memory chip the company said Thursday it has begun shipping as samples to major customers.(SK hynix)→
SK hynix said Thursday it has shipped samples of its 12-layer HBM4E, the next generation of high-bandwidth memory for artificial intelligence, to major customers, moving the company into the customer-qualification stage roughly thr
2026-06-18
digitimes.com
2026-06-18
Winbond's NOR flash has reportedly entered Nvidia's supply chain for the first time, as AI server demand drives a surge in memory consumption and Nvidia's next-generation Vera Rubin platform prepares for volume shipments in the second half of 2026. Industry sources said Winbond will align NOR flash shipments with customer rollout schedules and is expected to win a major share on the Vera Rubin pla
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.
2026-06-18
digitimes.com
2026-06-18
SK Group's combined market capitalization on the South Korean stock market surpassed KRW2,000 trillion (US$1.32 trillion) for the first time as of the June 16 close, driven by strength in AI memory demand and a high-profile visit by Nvidia's CEO that reinforced ties with SK Hynix and broader AI infrastructure plans. According to reports from SBS, YTN, ET Newsand Yonhap, the group's 19 listed subsi
2026-06-18
digitimes.com
2026-06-18
In an exclusive interview with The Wall Street Journal, Apple CEO Tim Cook made an unusually blunt admission. The company is preparing to raise product prices because memory and storage costs have surged to a point Apple can no longer absorb. He said Apple has spent the past stretch trying to shield customers from these cost increases, but the situation has become "unsustainable."
2026-06-18
digitimes.com
2026-06-18
SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on schedule.
2026-06-18
digitimes.com
2026-06-18
SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks to strengthen its lead in high-bandwidth memory (HBM) and secure talent for the fast-changing AI semiconductor market. Industry watchers said the move reflects a greater focus on practical creativity and execution in the AI era rather than formal academic credentials.
2026-06-18
digitimes.com
2026-06-18
Taiwan's listed semiconductor manufacturers reported strong May revenue figures, with a sweeping recovery in DRAM prices and rising artificial intelligence infrastructure spending lifting most of the sector's 27 tracked companies to double-digit year-on-year gains.
2026-06-18
digitimes.com
2026-06-18
Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations say could support future 3D chip-stacking designs for logic and memory devices.