Semiconductor News & Analysis Feed
73 articles
2026-07-10
finance.biggo.com
2026-07-10
finance.biggo.com
2026-07-10
digitimes.com
2026-07-10
Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening a new front in the competition over advanced memory performance, yield and supply.
2026-07-10
www.indexbox.io
2026-07-10
IndexBox
2026-07-08
electronics360.globalspec.com
2026-07-08
Electronics360
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2026-07-07
tomshardware.com
2026-07-07
Etiido Uko
Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.
2026-07-03
www.tradingkey.com
2026-07-03
TradingKey
On July 2, Eastern Time, U.S. markets diverged as AI hardware stocks retreated, causing the Nasdaq and Philadelphia Semiconductor Index to decline while the Dow hit a record high. BofA Securities attributes current volatility to supply-demand imbalances but remains optimistic due to strong underlying economic fundamentals. The market's growth leadership is shifting from mega-cap tech toward pro-cy
2026-07-01
digitimes.com
2026-07-01
SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than routine R&D reinforcement and as a sign that competition in the high-bandwidth memory (HBM) market has entered a new stage. As AI chips demand more from memory, logic design, advanced process nodes, and packaging integration, talent with system semiconductor and found
2026-06-30
futurumgroup.com
2026-06-30
The Futurum Group
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2026-06-29
eetimes.com
2026-06-29
If Europe wants true defense resilience, it must reduce its dependence on big foreign tech ecosystems.
2026-06-27
www.nature.com
2026-06-27
Nature
Research Briefing
Published: 26 June 2026
Ultrashort light pulses can transform a semiconductor into a topological insulator
Nature Physics (2026) Cite this article
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The electronic structure of materials can be tailored using pulses of light, and through this so-called Floquet engineering, novel materials can be designed. Now, the technique has been us
2026-06-26
digitimes.com
2026-06-26
On June 25, IBM unveiled what it calls the world's first sub-1nm chip technology: a 0.7nm — or 7 angstrom — transistor architecture built on an entirely new 3D platform called Nanostack. The announcement, timed to the VLSI 2026 symposium, marks the first time logic technology has extended below the 1nm node and, IBM says, opens a roadmap of at least a decade of further semiconductor scaling.
2026-06-22
news.futunn.com
2026-06-22
富途牛牛
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2026-06-22
www.moomoo.com
2026-06-22
Moomoo
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2026-06-22
digitimes.com
2026-06-22
Nvidia's planned US$20 billion strategic deal with Groq is built on a simple logic: as compute gets cheaper, demand keeps expanding. In a recent interview, Groq co-founder and CEO Jonathan Ross explained why Nvidia is expected to combine Groq's LPU with its latest Vera Rubin platform and how GPU and LPU can work as complementary engines in LLM inference.
2026-06-20
tomshardware.com
2026-06-20
Hassam Nasir
Another person has fallen victim to Amazon's generous return policy, as they received a disc drive, a mousepad, and an AV receiver instead of the $700 RTX 5070 they ordered.
2026-06-20
digitimes.com
2026-06-20
Efinix, a Cupertino-based FPGA startup founded in 2012, is making a push into edge AI with its newly launched Titanium Edge series — a family of chips the company says addresses longstanding power and security limitations in programmable logic devices.
2026-06-18
semiengineering.com
2026-06-18
Semiconductor Engineering
As logic devices transition from FinFETs to more complex gate-all-around (GAA) architectures, manufacturing variability has become a major barrier to achieving high yield.1,2 Hundreds of tightly coupled process steps now contribute to yield loss, making traditional wafer-based optimization slow, expensive, and often limited to addressing one failure mode at a time.3,4,5
To overcome these challeng
2026-06-18
www.indexbox.io
2026-06-18
IndexBox
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2026-06-18
digitimes.com
2026-06-18
Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.
2026-06-18
digitimes.com
2026-06-18
Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations say could support future 3D chip-stacking designs for logic and memory devices.