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The transition from laboratory-scale research to wafer-scale fabrication represents one of the most critical inflection points in the silicon carbide semiconductor industry. While SiC's superior electrical properties—higher breakdown voltage, wider bandgap, and superior thermal conductivity—have lon

SiC Wide Bandgap Wafer-scale Fabrication Power Semiconductor Substrate Growth Epitaxy Third-Generation Semiconductor EV Powertrain

EdgeCortix Unveils RAIDEN, a Scalable, Energy-Efficient AI Chiplet Platform for Physical AI - HPCwire

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www.hpcwire.com 2026-09-25

Leading semiconductor analyst says AMD should be investigated for 'treason' over availability of restricted chips in China, AMD blames diversion of export-controlled RFSoC

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tomshardware.com 2026-09-24

This incident exposes a structural weakness in the U.S. semiconductor export control framework: the tension between policy intent and enforcement reality. The XCZU47DR RFSoC is correctly classified under ECCN 3A001.a.14 as a dual-use item, yet the license exception permitting exports to Group B coun

AMD Export Control RFSoC Chip Diversion Dual-Use Technology Semiconductor Compliance FPGA RF Signal Processing

Leading semiconductor analyst says AMD should be investigated for 'treason' over availability of restricted chips in China, AMD blames diversion of export-controlled RFSoC — $36,000 radar silicon allegedly quoted at $1,000 for crowdfunding project - Tom's Hardware

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www.tomshardware.com 2026-09-24

Siemens, TSMC expand collaboration for AI-driven chip design - Bisinfotech

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www.bisinfotech.com 2026-09-24

German and Dutch Agencies Collaborate on AI Chip Design to Challenge US Dominance - Electronics For You BUSINESS

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www.electronicsforyou.biz 2026-09-24

Siemens and TSMC expand AI-driven semiconductor design collaboration - New Electronics

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