Semiconductor News & Analysis Feed
20 articles
2026-09-28
news.google.com
2026-09-28
2026-09-16
2026-09-14
sg.finance.yahoo.com
2026-09-14
Lorentz Solution and NVIDIA jointly presented advanced chip-level 3D electromagnetic (EM) extraction and sign-off technologies at the 2026 TSMC Open Innovation Platform (OIP) forum, focusing on ultra-high-speed silicon photonics and IC/3DIC designs. This marks the third consecutive year of collabora
2026-09-08
www.asiae.co.kr
2026-09-08
2026-09-08
www.asiae.co.kr
2026-09-08
2026-08-10
news.google.com
2026-08-10
2026-08-10
news.google.com
2026-08-10
2026-08-10
news.google.com
2026-08-10
2026-08-07
news.google.com
2026-08-07
2026-07-27
news.google.com
2026-07-27
2026-07-24
finance.biggo.com
2026-07-24
Lens Technology and Intel have announced a strategic partnership to jointly explore the application of Through-Glass Via (TGV) technology in next-generation advanced packaging. This collaboration marks Lens Technology's strategic expansion from consumer electronics precision manufacturing into the s
2026-06-29
technode.global
2026-06-29
NVIDIA and Australian AI firm Firmus Technologies have announced a strategic partnership to deploy up to 170,000 AI accelerators in Indonesia’s Batam campus, aiming for $25–$30 billion in revenue over the first six years. The collaboration leverages Firmus’s HyperCube liquid-cooled AI architecture a
2026-06-22
www.venturesquare.net
2026-06-22
Ingenious has partnered with Infineon Technologies and the Thailand Embedded Systems Association (TESA) to jointly develop an AI-based radar solution for patient monitoring and fall detection. This non-contact technology measures vital signs such as respiration and heart rate using 60GHz radar, and
2026-06-17
www.marketscreener.com
2026-06-17
Intron Technology, Infineon, Vector, and TASKING have jointly launched the DRIVECORE™ TC4 IT2 platform to accelerate R&D and mass production of autonomous driving, ADAS, and robotics applications. This platform integrates advanced hardware and software solutions, providing powerful computing capabil
2026-06-10
news.google.com
2026-06-10
2026-06-08
sg.finance.yahoo.com
2026-06-08
On June 8, 2026, Mitsubishi Electric and Semikron Danfoss announced the joint development of a new standard package for power semiconductor modules integrating 3-level circuits, aimed at improving efficiency in industrial drive equipment and renewable energy systems. Based on Mitsubishi's LV100 pack
2026-06-08
news.google.com
2026-06-08
2026-06-08
www.asiae.co.kr
2026-06-08
SK Hynix and NVIDIA have announced a joint effort to develop next-generation memory technologies for global AI factories, deepening their long-term partnership. Beyond enhancing memory performance, the collaboration integrates AI into semiconductor design and manufacturing simulation, advancing the
2026-05-30
www.techpowerup.com
2026-05-30
Microsoft and NVIDIA's joint teasing of the upcoming N1X chip signals a significant shift in the PC industry. This collaboration represents a strategic alliance between two tech giants, combining NVIDIA's GPU expertise with Microsoft's operating system and cloud capabilities. The N1X chip is positio
2026-05-11
www.digitimes.com
2026-05-11
Taiwan's semiconductor industry witnesses a significant collaborative project as Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit announce a joint venture to construct an advanced packaging facility in southern Taiwan's Kaohsiung. This partnership demonstrates the wo