Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging

Samsung and Qualcomm’s joint development of organic bridge technology for 2.1D packaging signals a critical shift toward higher-density, high-performance chip architectures. This advancement will accelerate upstream technologies such as EUV lithography, TSV, and silicon interposers, while forcing packaging vendors to rapidly scale advanced packaging capabilities. From a policy standpoint, this move intensifies geopolitical tensions between the U.S. and China, particularly affecting the competitive dynamics in advanced packaging between Taiwan, China, and the U.S. If adopted widely, the technology could erode the competitive edge of traditional packaging firms, compelling TSMC and UMC to accelerate R&D in 2.5D/3D packaging. Within the next 12 months, packaging costs for AI chips are expected to decline significantly, but technical barriers will rise, leading top players to strengthen IP portfolios. This trend underscores that packaging is becoming the decisive factor in chip performance, accelerating global semiconductor supply chain realignment.