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Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical's Korean subsidiary Dongwoo Fine-Chem to form a joint venture that will produce glass cores, a key material used in next-generation semiconductor package substrates, the companies said.

Kurita Industries has established a joint venture with Membrane Group India Private Limited to provide water and wastewater treatment solutions for India's growing electronics and semiconductor industry. The new company, Kurita Membrane India Private Limited, will design, manufacture, install, and maintain water treatment systems, including ultrapure water production, wastewater recycling, resour

Nan Pao Resins Chemical is accelerating its push into the high-end semiconductor materials market through a joint venture with Advanced Echem Materials Company and Trusval Technology, forming Advanced Pao Trusval Technology to target advanced packaging... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they

Nan Pao Resins Chemical is accelerating its push into the high-end semiconductor materials market through a joint venture with Advanced Echem Materials Company and Trusval Technology, forming Advanced Pao Trusval Technology to target advanced packaging adhesive materials.

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TSMC and Sony Semiconductor Solutions have signed a non-binding memorandum of understanding to establish a joint venture (JV) for next-generation image sensor development and manufacturing, with Sony holding the majority and controlling interest.The article requires paid subscription.Subscribe Now

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