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HBM2 DRAM2 NFC1 Bluetooth1 DualSense1 PS51 Apollo chiplet1 NPO1 chiplet1 optical interconnect1 dataflow architecture1 prefill-decode disaggregation1
2026-09-30
Applied Materials, Kioxia to Jointly Develop Next-Generation Memory - thelec.net
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www.thelec.net 2026-09-30
2026-09-28
SK Hynix and TSMC Jointly Validate HBM5, Wins Partner Award for Second Consecutive Year - finance.biggo.com
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news.google.com 2026-09-28
2026-09-23
Purdue, University of Illinois team up for joint semiconductor workforce initiative - starcitytv.com
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www.starcitytv.com 2026-09-23
2026-09-16
SK hynix reportedly discussing US memory chip manufacturing with Intel — options include leasing Ohio plant or forming joint venture with other AI hyperscalers - Tom's Hardware
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www.tomshardware.com 2026-09-16
2026-09-16
Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
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digitimes.com 2026-09-16
2026-09-15
The NY Creates and Micron Technology Joint Apprenticeship program welcomes first cohort - EurekAlert!
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news.google.com 2026-09-15
2026-09-14
Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP - Yahoo Finance Singapore
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sg.finance.yahoo.com 2026-09-14
Lorentz Solution and NVIDIA jointly presented advanced chip-level 3D electromagnetic (EM) extraction and sign-off technologies at the 2026 TSMC Open Innovation Platform (OIP) forum, focusing on ultra-high-speed silicon photonics and IC/3DIC designs. This marks the third consecutive year of collabora
Semiconductor DesignElectromagnetic Simulation3D EM ExtractionAI Data CentersSilicon PhotonicsChip VerificationTSMC OIPEDA Tools
2026-09-11
SolarEdge Falls 4% on Analyst Day Despite Joint NVIDIA 800 VDC Paper; Enphase Energy and First Solar Edge Higher - 24/7 Wall St.
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247wallst.com 2026-09-11
2026-09-09
Kioxia CEO Dismisses Talk of Joint Production with SK Hynix - finance.biggo.com
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finance.biggo.com 2026-09-09
2026-09-08
"Overcoming the Limits of Semiconductor Miniaturization"... Samsung Electronics and ASML to Jointly Develop Next-Generation 12-Inch Photo Masks - asiae.co.kr
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www.asiae.co.kr 2026-09-08
2026-09-08
"Overcoming the Limits of Semiconductor Miniaturization"... Samsung Electronics and ASML to Jointly Develop Next-Generation 12-Inch Photo Masks - asiae.co.kr
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www.asiae.co.kr 2026-09-08
2026-09-02
SK Group's Chey says SK Hynix open to joint production with Japan’s Kioxia: Asahi - KED Global
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www.kedglobal.com 2026-09-02
SK Group Chairman Chey Tae-won announced that SK Hynix is evaluating potential sites for memory chip manufacturing in Japan, reflecting the semiconductor industry's response to surging AI memory demand. This move demonstrates how the global semiconductor landscape is adapting to the rapid expansion
Semiconductor IndustryChip ManufacturingSK HynixJapanese SemiconductorAI ChipsMemory ChipsGlobal Supply ChainSemiconductor Investment
2026-09-01
South Korea-India joint venture opens semiconductor materials plant, targets China-free supply chain
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digitimes.com 2026-09-01
2026-08-31
SK hynix weighs joint memory plant in Japan as part of overseas expansion efforts - Korea JoongAng Daily
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news.google.com 2026-08-31
2026-08-26
GaN Power Stage for Humanoid Joints: IronDevice Debuts FoWLP Package Over Rival QFN - Tech Times
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www.techtimes.com 2026-08-26
2026-08-26
Heat Reduction in Robot Joints… Iron Devices Unveils Ultra-Small GaN Power Stages - 벤처스퀘어
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www.venturesquare.net 2026-08-26
2026-08-25
Novosense encoder launch highlights China's push into robot joint sensing
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digitimes.com 2026-08-25
2026-08-13
Formosa Plastics, Japan’s Daicel form semiconductor related joint venture - Taipei Times
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www.taipeitimes.com 2026-08-13
2026-08-12
Sony Semiconductor and TSMC Establishing Joint Venture | Business | Aug 2026 - Photonics Spectra
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www.photonics.com 2026-08-12
2026-08-12
TSMC approves new joint venture with Sony - Taipei Times
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www.taipeitimes.com 2026-08-12