Semiconductor News & Analysis Feed
20 articles
2026-09-29
www.electronicsforyou.biz
2026-09-29
2026-09-26
tech-insider.org
2026-09-26
2026-09-25
sg.finance.yahoo.com
2026-09-25
2026-09-24
tomshardware.com
2026-09-24
Micron's decision to end-of-life its 2GB GDDR7 chips signals a broader structural realignment in the memory industry, where AI-driven data center demand is systematically displacing consumer-grade products from supplier roadmaps. The move is strategically rational: Micron's 2GB GDDR7 held a marginal
2026-09-24
www.tomshardware.com
2026-09-24
2026-09-23
news.futunn.com
2026-09-23
2026-09-22
www.eetimes.com
2026-09-22
2026-09-22
2026-09-22
news.google.com
2026-09-22
2026-09-22
longbridge.com
2026-09-22
2026-09-22
www.digitimes.com
2026-09-22
GUC's 16 Gbps HBM4E IP on TSMC's N2P node marks a pivotal step in the HBM interface IP ecosystem, signaling that memory bandwidth scaling is now tightly coupled with leading-edge logic processes and advanced packaging. The jump from 12 Gbps on N3P to 16 Gbps on N2P underscores how quickly the HBM ro
2026-09-21
overclock3d.net
2026-09-21
2026-09-18
linuxgizmos.com
2026-09-18
2026-09-18
simplywall.st
2026-09-18
Micron Technology secures new growth opportunities in the AI era with its launch of 512GB server memory modules, addressing the rapidly growing demand for high-performance memory in AI computing and data centers. As artificial intelligence, machine learning, and deep learning technologies advance, t
2026-09-18
www.techradar.com
2026-09-18
2026-09-17
longbridge.com
2026-09-17
2026-09-16
www.tomshardware.com
2026-09-16
2026-09-16
tomshardware.com
2026-09-16
Micron has unveiled its first 512GB DDR5-9200 memory module, designed for high-memory applications such as AI data centers, analytics, virtualization, and in-memory databases. The module uses advanced vertical stacking packaging with through-silicon vias (TSVs), achieving over 60% lower power consum
2026-09-16
hothardware.com
2026-09-16
2026-09-16
www.tradingkey.com
2026-09-16