SemiPulse | AI-Powered Semiconductor Supply Chain Intelligence & Market Signals

AMD's expansion of ROCm support to RISC-V servers represents a significant strategic move in the AI computing landscape. ROCm, AMD's open-source heterogeneous computing platform designed for GPU-accelerated computing, is being extended to RISC-V architecture servers to address growing AI workload de

AMD ROCm RISC-V AI workloads Server chips Semiconductor technology Artificial intelligence Computing architecture

Advanced Micro Devices (AMD) Expands ROCm Support To RISC V Datacenter Servers - Yahoo Finance

0.9

finance.yahoo.com 2026-09-17

Advanced Micro Devices vs. Texas Instruments: Which Tech Stock Is a Better Buy in 2026? - The Motley Fool

0.84

www.fool.com 2026-09-17

Cadence and Analog Devices Develop DSP Architecture With 5X Performance Boost - AIM Media House

0.95

aimmediahouse.com 2026-09-17

Cadence Tensilica IP Powers Analog Devices’ Next-Generation SHARC-FX Core and New ADSP-SC84x/2184x Family - audioXpress

0.85

audioxpress.com 2026-09-16

On September 16, 2026, Cadence and Analog Devices (ADI) jointly announced the launch of a new generation of SHARC automotive audio processors, powered by Cadence's Tensilica DSP architecture and integrated into ADI's new ADSP-SC84x/2184x family. The upgrade moves from 28nm to 16nm process technology

Semiconductor chips DSP architecture Automotive audio processor Analog Devices Cadence Tensilica DSP 16nm process technology AI audio processing

Nanya-backed Piecemakers bets edge AI devices will diverge from reliance on HBM - Tom's Hardware

0.92

www.tomshardware.com 2026-09-16

Piecemakers bets edge AI devices will diverge from reliance on HBM

0.85

tomshardware.com 2026-09-16

PieceMakers, a DRAM designer backed by Nanya, has entered Taiwan's Emerging Stock Board with a strong market reception, seeing its stock price rise 23.6% on its debut. Unlike traditional HBM vendors, PieceMakers bets that AI inference memory will diverge from training memory, proposing a solution us

DRAM Design AI Inference HBM Hybrid Bonding Edge AI NVIDIA TSMC Semiconductor Supply Chain

Cadence Tensilica IP Powers Analog Devices' Next-Generation DSP Architecture - marketscreener.com

0.85

www.marketscreener.com 2026-09-16

AI-induced Memory shortage is changing how devices are built, Fairphone says memory now 60% of materials cost

0.85

tomshardware.com 2026-09-16

The ongoing memory shortage, driven by surging demand from AI data centers, is reshaping how consumer electronics are designed and manufactured. Smaller device makers, such as Fairphone, report that memory now accounts for nearly 60% of a device's bill of materials, significantly impacting productio

Memory shortage AI data centers Semiconductor supply chain Smartphone manufacturing DRAM chips Device design change Rising memory costs Supply chain risk

Rs 3,406 Crore Silicon Carbide Semiconductor Manufacturing Plant Approved In Odisha; To Produce 96 Million SiC Devices Annually - Swarajya

0.95

swarajyamag.com 2026-09-16

Cadence Tensilica IP Powers Analog Devices’ Next-Generation DSP Architecture - 01net

0.85

www.01net.it 2026-09-16

Cadence Tensilica IP Powers Analog Devices' Next-Generation DSP Architecture - GuruFocus

0.95

www.gurufocus.com 2026-09-16

Semiconductor News & Analysis Feed