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2026-05-11
Is Google TPU 8 the Future of AI Chip Design? - Analytics India Magazine
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analyticsindiamag.com 2026-05-11 Analytics India Magazine
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2026-05-11
NEWS: Three chip design firms get access to Arm's tokens - The Edge Malaysia
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theedgemalaysia.com 2026-05-11 The Edge Malaysia
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2026-05-11
Putrajaya backs three local firms to lead Made-in-Malaysia chip design drive under Arm partnership - The Vibes
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www.thevibes.com 2026-05-11 The Vibes
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2026-05-09
NVIDIA Rubin & Rubin Ultra Platforms Facing Design/Spec Issues As Per Rumors While AMD MI500 Positioned For 2H 2027 Launch - Wccftech
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wccftech.com 2026-05-09 Wccftech
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2026-05-08
Cadence Design Systems Stock Is Up 15% Year to Date. Here’s Why the AI Chip Design Boom Could Drive More Gains - TIKR.com
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www.tikr.com 2026-05-08 TIKR.com
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2026-05-08
Sony, TSMC Form Image Sensor Manufacturing Pact - Design and Development Today
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www.designdevelopmenttoday.com 2026-05-08 Design and Development Today
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2026-05-08
Omni Design Showcases Advanced AI and Chiplet IP at Global TSMC Technology Events - TipRanks
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www.tipranks.com 2026-05-08 TipRanks
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2026-05-08
Chip Designer Monolithic Must Litigate Investor’s Nvidia Suit - Bloomberg Law News
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news.bloomberglaw.com 2026-05-08 Bloomberg Law News
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2026-05-07
UAE to establish chiplet design, assembly hub in Lockheed Martin partnership - Caliber.Az
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caliber.az 2026-05-07 Caliber.Az
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2026-05-07
Tawazun and Lockheed Martin sign strategic agreement to establish UAE's chiplet design and assembly facility - ZAWYA
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www.zawya.com 2026-05-07 ZAWYA
Abu Dhabi –The UAE has entered the execution phase towards building a national microelectronics capability, following the signing of an agreement on the sidelines of the Make it in the Emirates 2026 between Tawazun Council for Defence Enablement and Lockheed Martin. The project will be executed in partnership with EDGE, one of the world’s leading advanced technologies and defence groups, and Khali
ChipletsMicroelectronicsDefense TechnologyUAE Semiconductor IndustryInternational CollaborationR&D CenterArtificial IntelligenceAerospace
2026-05-07
300 STEM students to join Selangor semiconductor chip design classes - mediaselangor.com
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mediaselangor.com 2026-05-07 mediaselangor.com
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2026-05-07
'Tawazun', 'Lockheed Martin' sign deal to establish UAE's chiplet design, assembly facility - ZAWYA
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www.zawya.com 2026-05-07 ZAWYA
ABU DHABI - The Tawazun Council for Defence Enablement and Lockheed Martin signed an agreement to establish an advanced microelectronics design and assembly facility in the United Arab Emirates, on the sidelines of the Make it in the Emirates 2026.The project will be executed in partnership with EDGE, one of the world’s leading advanced technologies and defence groups, and Khalifa University of Sc
ChipletsMicroelectronics DesignDefense TechnologyUAE Industrial DevelopmentInternational CooperationArtificial IntelligenceAerospaceSemiconductor Manufacturing
2026-05-07
NVIDIA Extreme Co Design Roadmap 2026 Large - ServeTheHome
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www.servethehome.com 2026-05-07 ServeTheHome
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NVIDIAServer ChipsAI ComputingData CenterSemiconductor Design3nm ProcessEUV LithographyHigh-Performance Computing
2026-05-07
Industrial AI: How Factories Learn to Live With Uncertainty
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eetimes.com 2026-05-07 Greg Fallon
Industrial AI is moving beyond controlled environments, with factories deploying systems designed to manage operational uncertainty.
Industrial AIUncertaintySmart ManufacturingSensor TechnologyMachine LearningFactory AutomationData-Driven Decision MakingPhysics-Based Modeling
2026-05-06
BigEndian Secures $6M Funding to Boost India's Chip Design Push - Asia Business Outlook
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www.asiabusinessoutlook.com 2026-05-06 Asia Business Outlook
Ensuring Excellent Mobile Connectivity for...
2026-05-06
Malaysia has 32 ARM chip design licenses. Here is what the government is actually doing with them. - CRN Asia
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www.crnasia.com 2026-05-06 CRN Asia
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2026-05-06
University of Sheffield hosts large-scale chip design workshop for UK students - New Electronics
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www.newelectronics.co.uk 2026-05-06 New Electronics
Organised by the School of Electrical and Electronic Engineering and supported by semiconductor firm EnSilica and a number of industry sponsors, the initiative used the Tiny Tapeout framework to deliver practical ASIC design experience. The approach, which uses a multi-project wafer (MPW) model, enables multiple designs to be manufactured together at reduced cost.According to organisers, the event
2026-05-06
Building for the Rising Complexity of Agentic Systems with Extreme Co-Design | NVIDIA Technical Blog - NVIDIA Developer
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developer.nvidia.com 2026-05-06 NVIDIA Developer
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2026-05-05
Generative AI for Chip Design Market Set to Boom Rapidly, - openPR.com
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www.openpr.com 2026-05-05 openPR.com
2026-05-05
Top News Today: AI Chip Design, Quantum Funding, Crypto Scam & More - Analytics Insight
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www.analyticsinsight.net 2026-05-05 Analytics Insight