Semiconductor News & Analysis Feed
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2026-05-27
www.aastocks.com
2026-05-27
AASTOCKS.com
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2026-05-27
eu.36kr.com
2026-05-27
eu.36kr.com
Yinggu Technology, a leading Chinese company in display chip design, successfully listed on the Hong Kong Stock Exchange.
启明创投
2026-05-27 10:53
In May 2026, Visionox Valley Technology was listed on the Hong Kong Stock Exchange, and Qiming Venture Partners welcomed its sixth IPO within the year.
On May 27, 2026, Beijing time, Visionox Technology Co., Ltd., an enterprise invested by Qiming Venture
2026-05-27
digitimes.com
2026-05-27
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
2026-05-27
digitimes.com
2026-05-27
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
2026-05-27
digitimes.com
2026-05-27
The world's largest chip designers are steadily growing more bullish on the future of cloud artificial intelligence (AI) chips known as ASICs (application-specific integrated circuits) — a market increasingly seen as the next major battleground in the global AI boom.
2026-05-27
digitimes.com
2026-05-27
Qualcomm has reached a deal to supply AI data center chips to ByteDance, giving the US smartphone processor designer a potentially high-volume customer as it tries to expand into AI infrastructure and custom silicon.
2026-05-26
tynmagazine.com
2026-05-26
TyN Magazine
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2026-05-26
qz.com
2026-05-26
qz.com
EMERGING TECHNOLOGIES
Huawei is unveiling a new 3D chip design it says can close the gap with global leaders
The Chinese tech giant says its new stacked-chip architecture can deliver transistor density equivalent to 1.4nm processes by 2031, without access to advanced lithography tools
By
Cris Tolomia
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Published 16 minutes ago
2026-05-26
english.news.cn
2026-05-26
Xinhua
SHANGHAI, May 26 (Xinhua) -- Chinese telecoms firm Huawei has unveiled its chip design approach at a major industry conference in Shanghai, referring to it as the Tau Scaling Law, "a new guiding principle for the future of semiconductors."
The announcement signals a potential new path for sustained evolution when the traditional roadmap of Moore's Law -- the long-held industry belief that transis
2026-05-26
www.lightreading.com
2026-05-26
Light Reading
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China's Huawei is feeling chipper about a new way of designing semiconductors that could fr
2026-05-26
www.mobileworldlive.com
2026-05-26
Mobile World Live
GREATER CHINA
HUAWEI
May 26, 2026
Huawei details fresh chip design philosophy
By Chris Donkin
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The president of Huawei’s semiconductors business department He Tingbo outlined a design methodology set to be used in its upcoming Kirin chips, an approach she backed to provide the means for it to continue to deliver cutting-edge silicon for mobile devices.
In a speech delivered at the 2026 IEE
2026-05-26
english.dotdotnews.com
2026-05-26
dotdotnews
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2026-05-26
news.google.com
2026-05-26
MarketBeat
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2026-05-26
www.newsghana.com.gh
2026-05-26
News Ghana
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2026-05-26
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2026-05-26
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2026-05-26
news.futunn.com
2026-05-26
富途牛牛
Unity Software(U.US) reported fourth-quarter financial results after the market close on Monday. Here's a rundown of the report.Q4 Earnings: Unity said fourth-quarter revenue increased 35% year-over-year to $609 million, beating the consensus estimate of $562.71 million. The company reported a quarterly loss of 66 cents per share.
Due to copyright issues, news from Dow Jones is temporarily unavai
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die — the specialized intellectual property that makes those chips communicate reliably has become critical infrastructure. InPsytech, a Taiwanese IP design firm and subsidiary of Egis Technology, has staked its business on exactly t
2026-05-26
marklapedus.substack.com
2026-05-26
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Huawei Describes New Chip/Design Scaling Methodology
Using this methodology, China’s Huawei plans to develop 1.4nm chips by 20
2026-05-26
www.ibtimes.com
2026-05-26
International Business Times
By
Merin Rebecca Thomas
Published 05/25/26 AT 3:55 PM EDT
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The company framed the development as part of a broader effort to strengthen China's domestic semiconductor supply chain amid ongoing technology controls imposed by Washington. HUAWEI
Huawei has said it has developed a new chip design approach it cla