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HBM5 EDA5 DRAM3 FinFET3 Blackwell3 Agentic AI3 GPU3 300mm wafer2 Memory Chips2 CoWoS2 SoIC2 Chiplet2
2026-09-29
NVIDIA Added a Record $150 Billion to Its Buyback. Here’s the Math Behind Spending $235 Billion by Early 2028 - TIKR.com
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www.tikr.com 2026-09-29
2026-09-29
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard - digitimes
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www.digitimes.com 2026-09-29
2026-09-29
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard - digitimes
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www.digitimes.com 2026-09-29
This DIGITIMES feature, the second installment in a series dissecting CoWoS, examines how TSMC transformed what began as a niche packaging experiment into the de facto industry standard for high-performance AI accelerators. The central insight is that the AI era has fundamentally restructured the se
Advanced PackagingCoWoSHeterogeneous IntegrationAI AcceleratorFoundryHBMChipletBack-end Packaging
2026-09-29
Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win - digitimes
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www.digitimes.com 2026-09-29
2026-09-28
“Behind AI’s Rapid Growth Lies Memory” — SK hynix Shares Its Next-Generation Memory Portfolio at the TSMC OIP Conference - SK hynix
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news.skhynix.com 2026-09-28
2026-09-27
Tower Semiconductor (TSEM) Jumped, What Is Behind The Latest Attention? - Yahoo Finance
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finance.yahoo.com 2026-09-27
Tower Semiconductor's inclusion in the PHLX Semiconductor Sector Index and its accelerating silicon photonics roadmap have triggered a sharp re-rating, yet the stock's valuation now sits at a premium that demands scrutiny. The company's strategic pivot toward integrated transmit-and-receive silicon
Tower SemiconductorSilicon PhotonicsSpecialty FoundryPHLX Semiconductor IndexOptical TransceiverAI InfrastructureValuation AnalysisP/E Ratio
2026-09-25
Qualcomm's CMO reveals the secret behind Snapdragon's rise - Yahoo Finance
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finance.yahoo.com 2026-09-25
2026-09-25
Applied Materials (AMAT), What Is Behind The Fresh Attention Today? - Yahoo Finance
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finance.yahoo.com 2026-09-25
2026-09-22
ASML Executive Warns Europe Will Fall Behind in Chip Development Due to Lack of Investment - marketscreener.com
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www.marketscreener.com 2026-09-22
2026-09-22
As AI ignites a frenzy in semiconductor capacity expansion, is Europe, home to lithography giant ASML Holding, falling seriously behind? ASML Holding: Zero sales in Europe in Q2 - Moomoo
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www.moomoo.com 2026-09-22
2026-09-22
Applied Materials Jumps 3.6% Behind a $5 Billion India Bet - Yahoo Finance
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finance.yahoo.com 2026-09-22
Applied Materials' $5 billion, decade-long commitment to India signals a strategic pivot toward one of the world's fastest-growing semiconductor markets. The plan—encompassing a 140-acre research park, 300mm cleanroom expansion, and a 100-plus supplier ecosystem—goes well beyond a simple sales offic
Applied MaterialsSemiconductor EquipmentIndia InvestmentWafer FabricationCleanroomSupplier EcosystemCapital ExpenditureSemiconductor Industry
2026-09-18
Applied Materials Edged Higher Behind a $5 Billion India Buildout - Yahoo Finance
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finance.yahoo.com 2026-09-18
2026-09-17
How Intel Researchers Are Advancing the Chemistry Behind High-NA EUV Tools - Intel
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www.intel.com 2026-09-17
2026-09-16
Meet the Face Behind India GaN Technology Breakthrough - Indianmasterminds
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indianmasterminds.com 2026-09-16
India's Defense Research and Development Organization (DRDO) showcased indigenous defense technologies at the Africa Aerospace and Defence Expo 2026 in South Africa, highlighting significant breakthroughs in gallium nitride (GaN) technology. This advancement represents a crucial milestone for India'
India semiconductorGaN technologyDefense technologyDRDOAerospace exhibitionSemiconductor materialsTechnology breakthroughIndian tech development
2026-09-16
China's open-weight AI models are now just 4 months behind frontier US offerings, Mozilla report claims
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tomshardware.com 2026-09-16
Mozilla's latest 'State of Open Source AI Report' reveals that Chinese open-weight AI models are closing the performance gap with U.S. frontier offerings by approximately four months. Based on data up to September 1, the report uses METR task-horizon metrics to show that open models lag behind close
AI modelsopen-source AIUS-China AI competitionMozilla reportAI developmentdata centerAI chipsmodel performance
2026-09-16
Micron Technology (MU), What Is Behind The Fresh Attention? - Yahoo Finance
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finance.yahoo.com 2026-09-16
2026-09-16
Nvidia Will Still Beat AMD Through 2028. Here's the Data Behind My Conviction. - Yahoo Finance
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finance.yahoo.com 2026-09-16
2026-09-16
Nvidia Will Still Beat AMD Through 2028. Here's the Data Behind My Conviction. - The Motley Fool
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www.fool.com 2026-09-16
2026-09-16
China’s YMTC Is Just 1 Year Behind The West On NAND, While CXMT Trails By Just 2 Years On DRAM And 3 Years On HBM, According To Korea Semiconductor Industry Association - Wccftech
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wccftech.com 2026-09-16
2026-09-15
DRDO develops GaN chip: Meet Dr Meena Mishra, scientist behind the technology that was denied by other cou - The Economic Times
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economictimes.indiatimes.com 2026-09-15