Semiconductor News & Analysis Feed

20 articles
2026-09-02
www.chosun.com 2026-09-02
2026-09-01
digitimes.com 2026-09-01
2026-09-01
www.digitimes.com 2026-09-01
SK Hynix is reportedly exploring Intel Foundry as a second source for high-bandwidth memory (HBM) base dies, signaling a strategic move to reduce reliance on TSMC. As HBM becomes increasingly critical in high-performance computing and AI applications, the logic layer manufacturing is gaining promine
2026-09-01
www.digitimes.com 2026-09-01
SK Hynix is reportedly exploring Intel Foundry as a second source for high-bandwidth memory (HBM) base dies, aiming to reduce reliance on TSMC. As HBM's underlying logic layer becomes increasingly critical for cost and performance, diversifying suppliers is a strategic move to enhance supply chain r
2026-09-01
finance.biggo.com 2026-09-01
Intel's stock rose 1.5% in early trading Monday after a Korean media report suggested SK Hynix, the world’s second-largest memory chipmaker, may consider using Intel Foundry for its next-generation HBM4E high-bandwidth memory base dies. Base dies are critical logic chips at the bottom of HBM stacks
2026-09-01
news.google.com 2026-09-01
2026-09-01
wccftech.com 2026-09-01
2026-08-31
news.google.com 2026-08-31
2026-08-31
news.google.com 2026-08-31
2026-08-31
www.expreview.com 2026-08-31
2026-08-31
news.google.com 2026-08-31
2026-08-31
news.google.com 2026-08-31
2026-08-31
www.mk.co.kr 2026-08-31
2026-08-31
www.investing.com 2026-08-31
2026-08-31
finance.biggo.com 2026-08-31
2026-08-31
www.investing.com 2026-08-31
2026-08-30
www.mk.co.kr 2026-08-30
The semiconductor industry is witnessing intensified competition for control of 'base die,' a critical component determining HBM performance. As AI and high-performance computing applications surge, HBM technology has become a key focus area. Base die, as the core component of HBM, directly impacts
2026-08-27
www.tomshardware.com 2026-08-27
2026-08-14
news.google.com 2026-08-14
2026-07-31
digitimes.com 2026-07-31