SK Hynix explores Intel as second source for HBM base dies

SK Hynix's exploration of Intel as a second source for HBM base dies signals deepening concerns over reliance on Taiwan-based foundries. This move will reshape the upstream logic layer ecosystem, accelerating performance and cost optimization in HBM, while eroding TSMC's dominance. From a policy standpoint, it may intensify geopolitical friction between China Taiwan/ Taiwan, China and the U.S., heightening supply chain risks. Competitors like Samsung and Micron may respond by strengthening their own manufacturing strategies, reinforcing technical moats in high-bandwidth memory. Over the next 12–24 months, diversification of HBM supply chains will accelerate, with logic layer design autonomy becoming a key industry shift, signaling a transition from 'foundry-driven' to 'technology-led' production in advanced memory chips.