Competition Intensifies for Control of the 'Base Die,' a Key to HBM Performance - 매일경제

The semiconductor industry is witnessing intensified competition for control of 'base die,' a critical component determining HBM performance. As AI and high-performance computing applications surge, H... Read original →

The contest for 'base die,' a core element in HBM technology, is reshaping the entire semiconductor value chain. Technologically, the race for 3nm and below EUV processes is intensifying, with TSMC and NVIDIA investing heavily to boost memory bandwidth and chip performance. Upstream wafer fabrication and equipment suppliers face rising precision demands, while downstream AI and data center applications increasingly rely on high-bandwidth memory. Geopolitically, U.S.-China tensions over advanced manufacturing are forcing supply chain realignment, with companies seeking to reduce reliance on Taiwan, China. In market strategy, NVIDIA may leverage chip architecture to strengthen ecosystem lock-in, while TSMC uses process leadership to maintain customer loyalty. Over the next 12-24 months, as base die technology matures, HBM adoption will expand into autonomous driving and edge computing, creating a dual competition for technical standards and market dominance.