Semiconductor News & Analysis Feed
85 articles
2026-07-20
digitimes.com
2026-07-20
Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major memory makers over stable mass production and supply. Industry sources say the next wave of high-capacity HBM will be decided by one core issue: how effectively vendors solve heat dissipation.
2026-07-18
digitimes.com
2026-07-18
As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates remain widely used, but rising demand for high-density interconnects, lower signal loss, and better dimensional stability is pushing glass substrates closer to commercial adoption.
2026-07-17
digitimes.com
2026-07-17
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
2026-07-16
digitimes.com
2026-07-16
Hanmi Semiconductor and Hanwha Semitech clashed in a Seoul courtroom over patents covering thermocompression bonders, or TC bonders, critical equipment used to stack DRAM chips vertically in high-bandwidth memory, or HBM.
2026-07-16
digitimes.com
2026-07-16
Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon photonics (SiPh) and Co-Packaged Optics (CPO). Benjamin Hein, CEO Electronics and Executive Board member at Merck, said advanced packaging materials are poised to outgrow front-end process materials and the broader mate
2026-07-16
digitimes.com
2026-07-16
South Korean President Lee Jae-myung unveiled the country's Three Mega Projects for AI and Semiconductors in late June 2026, an ambitious national strategy designed to strengthen South Korea's global leadership in artificial intelligence and semiconductors. The initiative centers on three pillars—semiconductors, physical AI, and AI data centers—and aims to double the nation's DRAM output within fi
2026-07-16
digitimes.com
2026-07-16
A US trade agency has opened an investigation that could block imports of the DDR5 server memory and high-bandwidth memory (HBM) feeding the AI data center boom, handing a small California patent holder a border lever that runs parallel to President Donald Trump's campaign to force chip production back onto US soil.
2026-07-15
digitimes.com
2026-07-15
Shanghai Orient Computing Core Technology has launched the DF1000, a 14-nanometre AI accelerator that uses software-defined computing and 3D-stacked near-memory architecture to reduce reliance on advanced process nodes and high-bandwidth memory, as Sohuand ICsmartreported.
2026-07-14
digitimes.com
2026-07-14
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising power consumption and data-transfer bottlenecks facing AI data centers.
2026-07-14
digitimes.com
2026-07-14
Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization targeted for around 2030. Although the path is fraught with ecosystem barriers and compatibility hurdles, Intel's parallel development of Z-angle memory (ZAM) and cross-batch memory (XBM) underscores its determination to re-enter the DRAM market, as it simultaneou
2026-07-14
digitimes.com
2026-07-14
Rambus has introduced a new DDR5 9600 server RDIMM chipset aimed at faster, denser data center memory systems. The move matters beyond one supplier because higher bandwidth and better power efficiency are becoming essential for AI inference, cloud computing, and HPC platforms used by businesses and consumers worldwide.
2026-07-13
digitimes.com
2026-07-13
SK hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging density, thermal control, and tighter integration with AI accelerators.
2026-07-13
digitimes.com
2026-07-13
GPUs have dominated AI infrastructure discussions over the past two years, powering everything from large language model (LLM) training and inference clusters to high-bandwidth memory (HBM), advanced packaging, and liquid-cooled server racks. As the industry races to expand computing capacity, GPUs have largely defined the conversation. That dynamic, however, may be beginning to change as CPUs div
2026-07-11
developer.nvidia.com
2026-07-11
NVIDIA Developer
Large language model (LLM) training workloads increasingly run into GPU memory limits before compute is fully used. Model weights, gradients, optimizer states, communication buffers, and intermediate activations all compete for GPU high-bandwidth memory (HBM). As model size, sequence length, and batch size grow, HBM capacity often becomes the primary scaling bottleneck.
This post explains how hos
2026-07-11
www.cnbc.com
2026-07-11
CNBC
Sign up for free newsletters and get more CNBC delivered to your inbox
Get this delivered to your inbox, and more info about our products and services.
© 2026 Versant Media, LLC. All Rights Reserved. A Versant Media Company.
Data is a real-time snapshot *Data is delayed at least 15 minutes. Global Business and Financial News, Stock Quotes, and Market Data and Analysis.
This site is now part of
2026-07-10
www.tomshardware.com
2026-07-10
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Researchers turn HBM on its side to tackle AI memory’s heat wall — Korean V-Die and Japanese MOSAIC designs promise higher bandwidth, denser stacks, and cooler future GPUs
News
By Etiido Uko
Published July 10, 2026
Technologies not yet proven as viable HBM alternatives
(Image credit: AMD)
Share this article
0
Join the conversation
Follow us
Add us as
2026-07-10
digitimes.com
2026-07-10
High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production costs, and long-term agreements lock up an increasing share of global DRAM capacity, according to memory industry sources.
2026-07-10
digitimes.com
2026-07-10
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging and leading-edge manufacturing equipment at the same time.
2026-07-09
digitimes.com
2026-07-09
Samsung Electronics and SK Hynix may take longer than expected to adopt hybrid bonding in next-generation high-bandwidth memory, as industry sources cited by ZDNetKoreasay the near-term case for the technology has weakened even though its long-term relevance remains intact.
2026-07-09
digitimes.com
2026-07-09
CXMT's STAR Market IPO suggests China's largest DRAM maker is prioritizing commodity memory over an aggressive near-term push into high-bandwidth memory (HBM). This eases concerns that Chinese suppliers are about to challenge the dominance of Samsung Electronics, SK Hynix, and Micron in AI memory.