Hanmi, Hanwha clash in court over HBM equipment patents

The patent clash between Hanmi and Hanwha over thermocompression bonding tools for HBM isn’t merely a legal tussle—it reveals acute supply chain fragility in advanced packaging. A restrictive ruling could force SK hynix and Samsung to absorb higher equipment costs or redesign stacking processes, while TSMC may tweak CoWoS material specs to sidestep infringement. Regulatory-wise, Korea’s tightening IP control paradoxically accelerates domestic substitution but undermines short-term resilience—only three global vendors can mass-produce these tools. Micron and Intel will likely pivot toward non-Korean equipment partners to dilute Seoul’s HBM leverage. Within 18 months, expect Japan and the Netherlands to fast-track hybrid bonding alternatives. If Korean firms fail to establish an open patent consortium by 2027, they risk losing influence over HBM3E standards entirely.