Semiconductor News & Analysis Feed

High-bandwidth memory (HBM) is emerging as a critical testbed for 3D assembly testing and yield optimization. As data centers increasingly rely on high-performance computing for AI and graphics workloads, HBM's vertical stacking architecture delivers unmatched bandwidth through tightly coupled DRAMs

On June 24, 2026, South Korean company SPHERE AX and U.S. AI semiconductor firm Blaize signed a strategic memorandum of understanding (MOU) at the National Assembly in South Korea, aiming to jointly develop AI semiconductor-based products and advance their presence in the global Physical AI market.

IDI Dynamics, a subsidiary of ISDN Holdings, has launched a next-generation high-speed laser marking system designed to enhance productivity in semiconductor assembly and test (OSAT) operations. The device achieves 2.5x higher marking speed while occupying 22% less floor space, significantly improvi

The UAE has taken a significant step toward building national microelectronics capabilities, following a strategic agreement signed between the Tawazun Council for Defence Enablement and Lockheed Martin during the Make it in the Emirates 2026 event. The initiative, executed in partnership with EDGE

The Tawazun Council for Defence Enablement and Lockheed Martin have signed a deal to establish a state-of-the-art chiplet design and assembly facility in the UAE, marking a significant step toward enhancing the country's indigenous microelectronics capabilities. This initiative, announced during the