Semiconductor News & Analysis Feed

Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity remains tight, pushing demand into foundries, back-end assembly, testing, and overseas fabs. The strain is creating spillover opportunities across the broader semiconductor supply chain, while also exposing how dependent the market has become on limited high-end capac

India Prime Minister Narendra Modi inaugurated CG Semi's Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat, marking the start of commercial production at what the government described as the country's third semiconductor plant to become operational in 2026. The project forms part of New Delhi's broader effort to build a domestic semiconductor ecosystem under its India S

Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since late 2025, outsourced semiconductor assembly and test, or OSAT, capacity has tightened steadily. New capacity added in 2026 has also been filled quickly, prompting multiple IC design houses to lock in capacity and pus

SPHERE AX Partners with U.S. AI Semiconductor Company Blaize at the National Assembly USA - English NEWS PROVIDED BY Blaize Inc. Jun 24, 2026, 06:00 ET SHARE THIS ARTICLE Korea-U.S. Physical AI Cooperation Gets Underway -- Joint Development of AI Semiconductor-Based Products EL DORADO HILLS, Calif. and SEOUL, South Korea, June 24, 2026 /PRNewswire/ -- SPHERE AX (CEO: Yunha Park), a com

Penang has played a critical role in the global semiconductor back-end industry for decades, particularly in assembly, testing, and packaging (ATP). The region has built a highly competitive industrial base and, amid supply chain diversification and geopolitical shifts, has recently attracted record levels of investment.

Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering, automation and system integration, while moving into higher-value equipment manufacturing and R&D. Following the opening of Galatek's new facility in Penang, Malaysia, DIGITIMES spoke with Galatek Malaysia general manag

Poland is seeking major Taiwanese investment to strengthen its manufacturing base, a shift that could reshape Europe's supply chains and technology capacity. The plan spans electric vehicles, semiconductors, and industrial policy, and reflects how governments are adapting to geopolitical pressure and shortages in key global sectors.

Galatek Technologies has opened a manufacturing, assembly, and delivery center in Penang, marking the AI-enabled automation and semiconductor equipment supplier's first manufacturing site in Malaysia.

The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers and supply chains, the shift suggests stronger demand for Taiwan's packaging and testing firms, alongside a broader rebalancing of semiconductor production.

As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl

New High-speed Laser Marker delivers 2.5x higher chip throughput (units per hour) in a 22% smaller footprint, helping Outsourced Semiconductor Assembly & Test (OSAT) manufacturers drive productivity of valuable production floor space SINGAPORE, May 26, 2026 /PRNewswire/ -- IDI Dynamics, a subsidiary of ISDN Holdings Limited (SGX: I07 / 1656.HK), has launched its next generation High-speed Laser M

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Abu Dhabi –The UAE has entered the execution phase towards building a national microelectronics capability, following the signing of an agreement on the sidelines of the Make it in the Emirates 2026 between Tawazun Council for Defence Enablement and Lockheed Martin. The project will be executed in partnership with EDGE, one of the world’s leading advanced technologies and defence groups, and Khali

ABU DHABI - The Tawazun Council for Defence Enablement and Lockheed Martin signed an agreement to establish an advanced microelectronics design and assembly facility in the United Arab Emirates, on the sidelines of the Make it in the Emirates 2026.The project will be executed in partnership with EDGE, one of the world’s leading advanced technologies and defence groups, and Khalifa University of Sc