Semiconductor News & Analysis Feed
1103 articles
2026-06-19
www.ad-hoc-news.de
2026-06-19
AD HOC NEWS
TSMCs, Capacity
TSMC's Capacity Conundrum: Record Earnings Mask the CoWoS Squeeze Forcing Clients to Samsung
19.06.2026 - 17:56:59 | boerse-global.de
Despite 58% profit surge, TSMC's advanced packaging capacity is fully booked through 2026, forcing Google, BYD, AMD, and Tesla to turn to Samsung. TSMC partners Amkor for US expansion; stock near all-time high.
TSMCs - TSMC's Capacity Conundrum: Re
2026-06-19
wccftech.com
2026-06-19
Wccftech
Imitation remains the highest form of flattery. After Samsung won plaudits for the Exynos 2600's novel Heat Path Block (HPB) thermal technology, Qualcomm, whose recent chips iterations have resembled a veritable inferno when it comes to their runaway heat issues, now appears to be flattering Samsung by copying its HPB tech for the upcoming Snapdragon 8 Elite Gen 6 Pro, albeit sloppily so.
2026-06-19
www.techtimes.com
2026-06-19
Tech Times
By Allen Lee
Published: Jun 19 2026, 10:08 AM EDT
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A visitor takes a picture of a model of SK hynix's high-bandwidth memory (HBM) technology during the 2025 World IT Show in Seoul on April 24, 2025. South Korean chip giant SK hynix reported record quarterly profits on April 24, thanks to soaring
2026-06-19
www.kedglobal.com
2026-06-19
KED Global
KOSPI 200 ETF debuts in Hong Kong amid growing demand for direct, greater access to Korean stocks
Hong Kong Stock Exchange (Courtesy of Getty Images) Overseas investors are increasingly buying South Korean equities directly, as exchange traded funds (ETFs) linked to Korean stocks proliferate across Hong Kong, the US and Europe, providing greater access to the Korean market.The shift, which
2026-06-19
www.kedglobal.com
2026-06-19
KED Global
Samsung mulls chip packaging plant in Saemangeum, following moves by Hyundai Motor, SK, LG
Samsung Electronics' chip cleanroom South Korea's Saemangeum development zone is transforming into one of the country's most important advanced manufacturing clusters, with Samsung Electronics Co. weighing the area as a potential site for a new semiconductor packaging facility alongside the nea
2026-06-19
en.sedaily.com
2026-06-19
Seoul Economic Daily
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2026-06-19
finance.yahoo.com
2026-06-19
Yahoo Finance
South Korea’s KOSPI Tops 9,000 but Samsung and SK Hynix Did the Work
Darryn Pollock
Thu, June 18, 2026 at 6:52 PM PDT 2 min read
005930.KS
-0.14%
000660.KS
+5.61%
NVDA
-0.97%
032830.KS
-9.36%
402340.KS
+10.67%
Trade NVIDIA on Coinbase
Trading disclosure
South Korea's KOSPI closed at a record 9,063.84 on June 18, crossing 9,000 for the first time in history. The index gained 2.25% on the day. Just
2026-06-19
digitimes.com
2026-06-19
Samsung Electronics' foundry business has signed a strategic manufacturing collaboration with Claros, a US power-management startup, to produce semiconductors designed to cut energy waste inside AI data centers, according to a Claros announcement and a report by ZDNet Korea.
2026-06-18
wccftech.com
2026-06-18
Wccftech
Samsung has proven that it can leverage its advanced nodes to develop and mass produce cutting-edge chipsets, with the Exynos 2700 said to arrive on schedule as the company is progressing with its development without any reported hiccups. However, just because the Korean giant’s second-generation 2nm GAA SoC is showing promise, it doesn’t mean the entire division is moving with the same pace and e
2026-06-18
www.proactiveinvestors.com
2026-06-18
Proactive financial news
Tech
Written by:
Ian Lyall
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Samsung draws advanced chipmaking interest as TSMC capacity tightens
Published: 05:50 18 Jun 2026 EDT
Samsung Electronics Co Ltd (ADR) (LSE:BC94) is attracting growing interest from prospective customers seeking advanced semiconductor manufact
2026-06-18
uk.finance.yahoo.com
2026-06-18
Yahoo Finance UK
Samsung draws advanced chipmaking interest as TSMC capacity tightens
Proactive
Thu, 18 June 2026 at 2:50 am GMT-7 2 min read
005930.KS
-0.14%
2330.TW
+4.15%
002594.SZ
-0.61%
005935.KS
+0.90%
AMD
+1.35%
Samsung draws advanced chipmaking interest as TSMC capacity tightens Proactive uses images sourced from Shutterstock
Samsung Electronics Co Ltd (ADR) (LSE:BC94) is attracting growing interest from
2026-06-18
ca.finance.yahoo.com
2026-06-18
Yahoo! Finance Canada
Samsung draws advanced chipmaking interest as TSMC capacity tightens
Proactive
Thu, June 18, 2026 at 2:50 a.m. PDT 2 min read
005930.KS
-0.14%
TSM
+6.94%
002594.SZ
-0.61%
005935.KS
+0.90%
AMD
+4.86%
Samsung draws advanced chipmaking interest as TSMC capacity tightens Proactive uses images sourced from Shutterstock
Samsung Electronics Co Ltd (ADR) (LSE:BC94) is attracting growing interest from pro
2026-06-18
www.mk.co.kr
2026-06-18
매일경제
사진 확대
Samsung Electronics' System LSI Business said it has set profitability improvement as its top priority after posting record quarterly sales in the first quarter of this year. It also said it plans to enter the AI data center market and expand its mobile-centered business structure into the future infrastructure sector.
At a business briefing held on the 18th, Yong-In Park, president and hea
2026-06-18
letsdatascience.com
2026-06-18
Let's Data Science
INFRASTRUCTURE
semiconductors
foundry market
supply chain
TSMC Capacity Crisis Benefits Samsung Foundry
4 sources
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June 18, 2026
7.0
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Photo: gizmochina.com · rights & takedowns
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TSMC's leading-edge capacity is fully locked up by NVIDIA, Apple, and Broadcom, prompting a wave of customer conversations with Samsung Foundry. According to Nikkei Asia, AMD is in talks
2026-06-18
www.tweaktown.com
2026-06-18
TweakTown
SK Hynix and Samsung race to build the memory powering NVIDIA and AMD's next AI monsters
SK Hynix confirms it has delivered its first HBM4E samples to its partners, marking the first delivery of next-gen data center components.
VIEW GALLERY - 3
Jak Connor
Tech and Science Editor
Published Jun 18, 2026 3:31 AM CDT
1 minute & 30 seconds read time
TL;DR: SK Hynix has delivered its first HBM4E memor
2026-06-18
www.moomoo.com
2026-06-18
Moomoo
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2026-06-18
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www.digitimes.com
2026-06-18
digitimes
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square."...
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