Samsung draws advanced chipmaking interest as TSMC capacity tightens - Yahoo! Finance Canada

As demand for advanced chips surges globally, Taiwan Semiconductor Manufacturing Company's (TSMC) capacity constraints are drawing increasing attention to Samsung Electronics' chip manufacturing capab... Read original →

TSMC’s capacity crunch is triggering a structural realignment in the advanced-node supply chain. Technically, Samsung’s 3nm GAA process—now eyed for AMD’s 2028 CPUs and Google’s Axion chips—will force EDA, packaging, and EUV materials suppliers to adapt to a non-TSMC node, raising NRE costs. On compliance, while Chinese automakers like BYD gain short-term supply diversification by shifting to Samsung, the latter’s Xi’an fab remains constrained by U.S. equipment licensing, undermining long-term reliability. Strategically, TSMC may accelerate expansions in Arizona and Japan while offering ‘capacity options’ to lock in key clients; Samsung, meanwhile, will leverage pricing flexibility to capture tier-2 AI chipmakers. Over the next 12–24 months, this divergence will amplify ‘capacity premiums’ at leading nodes and accelerate Chiplet adoption, driving a decentralized manufacturing tailwind across the semiconductor ecosystem.