Semiconductor News & Analysis Feed
20 articles
2026-09-30
2026-09-17
finance.biggo.com
2026-09-17
2026-09-16
2026-08-27
www.thelec.net
2026-08-27
Qualcomm announced that it is working alongside Samsung Electronics and SK Hynix to advance HBC (High Bandwidth Cache) technology for HBM (High Bandwidth Memory), highlighting a significant step forward in semiconductor memory innovation. This collaboration is expected to enhance performance and eff
2026-08-26
hothardware.com
2026-08-26
Apple unveiled its new M6 and M5 Ultra chips alongside an upgraded Mac Mini and Mac Studio on August 26, 2026. The M6, Apple's first 2nm processor, powers the Mac Mini with a redesigned 12-core CPU and integrated neural accelerators in the GPU, delivering up to four times faster AI performance and d
2026-08-26
www.etvbharat.com
2026-08-26
2026-08-26
www.gadgets360.com
2026-08-26
2026-08-04
www.sammyfans.com
2026-08-04
2026-07-27
news.google.com
2026-07-27
2026-07-24
stocktwits.com
2026-07-24
NVIDIA CEO Jensen Huang made his first public endorsement of open-weight AI on X (formerly Twitter), aligning with Meta, Microsoft, and Palantir. This move signals a growing industry trend toward openness and collaboration in AI development. Open-weight AI emphasizes model accessibility and transpar
2026-07-05
news.google.com
2026-07-05
2026-07-02
www.tradingview.com
2026-07-02
As SK Hynix prepares for its public offering, Themes ETFs has launched two leveraged ETFs—SKHX (2x long) and SKHZ (1x short)—to provide investors with efficient, low-cost tools for trading the semiconductor giant. SK Hynix, a leading supplier of high-bandwidth memory chips crucial for AI accelerator
2026-06-29
news.google.com
2026-06-29
2026-06-22
qz.com
2026-06-22
NVIDIA's launch of a safety system for humanoid robots represents a significant advancement in AI-powered robotics, addressing critical safety concerns for human-robot collaboration. This development marks a pivotal moment in the transition from theoretical robotics to practical applications, as hum
2026-05-29
cryptobriefing.com
2026-05-29
MediaTek is adopting a dual chip packaging strategy in response to strained capacity at TSMC, the world's leading foundry, as demand for AI chips intensifies. By integrating Intel’s EMIB technology alongside TSMC’s CoWoS and SoIC services, MediaTek aims to mitigate risks associated with over-relianc
2026-05-29
cryptobriefing.com
2026-05-29
MediaTek has announced that it is now integrating advanced packaging technologies from both Intel and TSMC in its AI chip designs, highlighting growing capacity constraints in the semiconductor supply chain driven by AI demand. TSMC’s CoWoS packaging has been under significant strain due to high dem
2026-05-29
www.msn.com
2026-05-29
Amid the surge in artificial intelligence-driven demand, the semiconductor industry is experiencing a new wave of growth, with several leading chipmakers crossing the trillion-dollar market capitalization threshold. SK Hynix, the world's second-largest memory chipmaker, has seen its stock more than
2026-05-27
2026-05-26
www.01net.it
2026-05-26
Magnachip plans to showcase its MV MOSFET portfolio at the 2026 PCIM Europe exhibition, focusing on AI server and data center applications. This presentation will be alongside the company's broader power semiconductor product line, demonstrating its technological capabilities in high-performance pow
2026-05-26
www.morningstar.com
2026-05-26