Semiconductor News & Analysis Feed
310 articles
2026-07-03
digitimes.com
2026-07-03
TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term partnerships to help Taiwanese equipment, materials, and chemical suppliers enter the advanced semiconductor supply chain. The move is steadily building a more resilient and complete local supply system, with both CoWoS and panel-level advanced packaging (CoPoS) now s
2026-07-02
www.indexbox.io
2026-07-02
IndexBox
2026-07-02
www.investing.com
2026-07-02
Investing.com
2026-07-02
www.marketscreener.com
2026-07-02
marketscreener.com
2026-07-02
ca.investing.com
2026-07-02
Investing.com Canada
2026-07-02
www.prnewswire.com
2026-07-02
PR Newswire
2026-07-02
www.prnewswire.com
2026-07-02
PR Newswire
2026-07-02
www.linkedin.com
2026-07-02
LinkedIn
2026-07-01
www.trendforce.com
2026-07-01
TrendForce
2026-07-01
finance.biggo.com
2026-07-01
finance.biggo.com
2026-07-01
digitimes.com
2026-07-01
South Korea's government laid out a detailed plan on June 30 for building its southwest region into a major new semiconductor production base, with SK, Samsung Electronics and Amkor outlining a combined KRW896 trillion (approx. US$581 billion) in investment covering memory chip fabs, AI data centers and advanced packaging.
2026-06-30
www.thelec.net
2026-06-30
thelec.net
Applied Materials’ enhanced Centura Prime Epi system (Photo=Applied Materials)
Applied Materials has introduced six new semiconductor manufacturing systems for DRAM and advanced packaging, expanding its portfolio of 3D semiconductor equipment aimed at improving the performance and power efficiency of next-generation memory used in artificial intelligence (AI) processors.
The company unveiled
2026-06-30
www.digitimes.com
2026-06-30
digitimes
As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals giant DuPont and separately listed — is likewise expanding its production capacity investment in Taiwan. Asia-Pacific president...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they
2026-06-30
www.digitimes.com
2026-06-30
digitimes
As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals giant DuPont and separately listed — is likewise expanding its production capacity investment in Taiwan. Asia-Pacific president...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they
2026-06-30
digitimes.com
2026-06-30
As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven investment wave is now spreading beyond foundries into the equipment, materials, factory engineering, and inspection supply chains.
2026-06-30
digitimes.com
2026-06-30
AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs, tightening capacity across both 8-inch mature processes and 12-inch advanced nodes. CoWoS's advanced packaging and HBM capacity are also set for a prolonged supply shortage, effectively rewriting the foundry industry's business cycle.
2026-06-30
digitimes.com
2026-06-30
Qnity, the independent company spun off from US chemicals giant DuPont, is ramping up investment in Taiwan as the island cements its role at the center of the global AI hardware supply chain. Asia-Pacific president Dennis Chen said in an interview with DIGITIMESthat future spending will focus on three main battlegrounds: advanced packaging, co-packaged optics (CPOs), and thermal management.
2026-06-29
logisticsbusiness.com
2026-06-29
Logistics Business
More than 160 attendees representing 87 companies across 30 countries gathered at the headquarters of CMC Packaging Automation for CID26 – CMC Innovation Day 2026, the company’s annual event dedicated to innovation in fulfilment automation, systems integration and right-sized packaging.
Built around the theme ‘Ecosystem’, CID26 brought together customers, technology partners, policymakers and ind
2026-06-29
biz.chosun.com
2026-06-29
Chosunbiz
By
Jeong Du-yong
Published 2026.06.29. 10:01
The lineup of 3D chip manufacturing equipment for AI semiconductors unveiled by Applied Materials./Courtesy of Applied Materials
Semiconductor equipment corporations Applied Materials unveiled a lineup of 3D chip manufacturing tools for artificial intelligence (AI) semiconductors. The focus is on expanding planarization, deposition and metrology tools
2026-06-29
digitimes.com
2026-06-29
Global revenue for the semiconductor industry's "Foundry 2.0" market reached US$86 billion in the first quarter of 2026, up 23% year-over-year, driven by strong demand for AI accelerators and advanced packaging, according to Counterpoint Research.