Semiconductor News & Analysis Feed
311 articles
2026-06-03
www.tradingview.com
2026-06-03
TradingView
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2026-06-02
semiconductor.samsung.com
2026-06-02
samsung.com
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Every era of computing is defined by the infrastructur
2026-06-02
www.digitimes.com
2026-06-02
digitimes
Nvidia CEO Jensen Huang has repeatedly backed TSMC's price hikes, saying its advanced process and supply-chain services are difficult and highly valuable. As AI chip demand surges, TSMC, Samsung Electronics, SK Hynix, Micron, and other top semiconductor...
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2026-06-01
www.deccanherald.com
2026-06-01
Deccan Herald
Bengaluru: Semiconductors are evolving from standalone components into tightly integrated systems that underpin the digital economy. This structural shift presents a timely opportunity for India to leapfrog legacy stages and position itself as a competitive force across critical segments of the global semiconductor supply chain, said NITI Aayog in its report ‘Future of India’s Semiconductor Indust
2026-05-30
telecom.economictimes.indiatimes.com
2026-05-30
ET Telecom
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2026-05-30
digitimes.com
2026-05-30
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations.
2026-05-30
seekingalpha.com
2026-05-30
Seeking Alpha
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2026-05-30
wtvbam.com
2026-05-30
WTVB
By Wen-Yee Lee
TAIPEI, May 29 (Reuters) – Taiwan chip designer MediaTek said on Friday it supports both TSMC’s and Intel’s advanced packaging technologies, allowing customers to choose between the two approaches.
“We’re one of the few custom silicon providers that support both (TSMC’s) CoWoS and (Intel’s) EMIB. We let our customers choose,” MediaTek Senior Vice President Vince Hu told reporter
2026-05-29
www.tradingview.com
2026-05-29
TradingView
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2026-05-29
www.zacks.com
2026-05-29
Zacks Investment Research
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2026-05-29
wkzo.com
2026-05-29
WKZO
By Wen-Yee Lee
TAIPEI, May 29 (Reuters) – Taiwan chip designer MediaTek said on Friday it supports both TSMC’s and Intel’s advanced packaging technologies, allowing customers to choose between the two approaches.
“We’re one of the few custom silicon providers that support both (TSMC’s) CoWoS and (Intel’s) EMIB. We let our customers choose,” MediaTek Senior Vice President Vince Hu told reporter
2026-05-29
www.thestar.com.my
2026-05-29
thestar.com.my
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2026-05-29
www.reuters.com
2026-05-29
Reuters
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2026-05-29
www.tradingview.com
2026-05-29
TradingView
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2026-05-29
www.moomoo.com
2026-05-29
Moomoo
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2026-05-29
www.digitimes.com
2026-05-29
digitimes
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.
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2026-05-29
www.thelec.net
2026-05-29
thelec.net
Innometri signs a memorandum of understanding with LaserCell to jointly develop non-destructive semiconductor inspection equipment. (Photo: Innometri)
Innometri said it signed a memorandum of understanding with LaserCell to jointly develop non-destructive semiconductor inspection equipment.
The two companies will cooperate on developing X-ray and computed tomography (CT) systems capable of inspe
2026-05-29
digitimes.com
2026-05-29
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.
2026-05-29
digitimes.com
2026-05-29
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.
2026-05-29
digitimes.com
2026-05-29
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging as key names to watch. Supply-chain sources say the shift could reshape who captures future demand for advanced packaging.