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Entegris recently entered a non-exclusive cross-licensing agreement with JSR and Inpria, resolving a patent dispute and expanding access to next-generation EUV photoresist technologies for AI-driven chips. This move not only removes a legal overhang but also reinforces Entegris' strategic position i

As AI chip power consumption surges, traditional silicon-based power architectures are approaching physical limits, prompting an industry-wide shift toward 800V high-voltage direct current (HVDC) systems. In this context, silicon carbide (SiC) has emerged as a critical material for solid-state trans