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Trending Technologies
EDA5 Agentic AI3 Adreno GPU2 Hexagon NPU2 Adreno Neural Fusion2 Chiplet2 DRAM2 Memory Chips2 Blackwell2 3D NAND2 Flash Memory2 Bluetooth 6.02
2026-09-16
MediaTek's Dimensity 9600 Pro Debuts on TSMC 2nm, Runs 30B AI Models On-Device with LPDDR6 Support - XenoSpectrum
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xenospectrum.com 2026-09-16
2026-09-14
China's AI Chip Makers See Revenue Soar, But CUDA and HBM Still Keep Them Behind NVIDIA - XenoSpectrum
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xenospectrum.com 2026-09-14
2026-09-11
Kepler Computing Unveils EUV-Free Ferroelectric AI Memory, Targeting 10x HBM Capacity via 28nm Fab Retrofits - XenoSpectrum
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xenospectrum.com 2026-09-11
Kepler Computing unveiled a novel ferroelectric AI memory technology on September 9, 2026, targeting the memory bottlenecks in current AI infrastructure. By combining ferroelectric materials with 3D stacking, the company achieves up to 10x the capacity of HBM without relying on advanced EUV lithogra
Ferroelectric MemoryAI MemoryEUV LithographySemiconductor Manufacturing28nm ProcessHBMMemory TechnologyChip Fabrication
2026-09-10
World's First SiC Superjunction MOSFET Debuts With 1,635V Rating and Near-Zero Thermal Drift - XenoSpectrum
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xenospectrum.com 2026-09-10
The world's first 1,635V silicon carbide (SiC) superjunction MOSFET has been commercialized by AlkaidSemi, a Shanghai-based power semiconductor company, marking a significant breakthrough in high-voltage device performance. The device achieves an extremely low specific on-resistance of 1.27 mΩ⋅cm² a
Silicon CarbidePower SemiconductorSuperjunction TechnologyMOSFETThermal DriftSiC DeviceElectric VehiclesAI Data Centers
2026-09-09
Intel's High-NA EUV Tops 1 Million Wafers as TSMC Joins Push for 12-Inch Masks by 2033 - XenoSpectrum
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xenospectrum.com 2026-09-09
2026-09-09
Samsung to Adopt High-NA EUV by 2028, TSMC by 2030—Ahead of Larger Photomask Standard - XenoSpectrum
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xenospectrum.com 2026-09-09
2026-09-04
China's Server Market Is Still 74% x86 — So Why Is Beijing Betting on RISC-V? - XenoSpectrum
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xenospectrum.com 2026-09-04
2026-09-01
NVIDIA's $3.5 Billion MediaTek Bond Deal Ties Advanced Packaging to NVLink - XenoSpectrum
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news.google.com 2026-09-01
2026-09-01
Intel's Advanced Packaging Business Won't Ramp Until 2029, CFO Says - XenoSpectrum
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news.google.com 2026-09-01
2026-09-01
MediaTek Builds Advanced Packaging Team to Control AI ASIC Production End to End - XenoSpectrum
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news.google.com 2026-09-01
2026-09-01
China's CXMT Said to Produce HBM3E in Small Batches as AI Chipmakers Begin Testing - XenoSpectrum
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xenospectrum.com 2026-09-01
2026-09-01
EPFL's Charge-Balanced GaN Transistor Blocks 3.4 kV by Taming Electric Field Concentration - XenoSpectrum
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xenospectrum.com 2026-09-01
EPFL's POWERlab has developed a charge-balanced gallium nitride (GaN) transistor on silicon (GaN-on-Si) that achieves a blocking voltage of 3.4 kV. Published in Nature Electronics, this work introduces a dopant-free polarization super-junction (iPSJ) drift region that mitigates electric field concen
GaN transistorcharge balancingGaN-on-Sielectric field concentrationpower semiconductorpower electronicssemiconductor materialsdevice structure design
2026-08-31
TSMC's CoWoS Packaging Capacity Grew 9x in Three Years, Yet AI Chip Shortage Remains - XenoSpectrum
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xenospectrum.com 2026-08-31
2026-08-29
How Rapidus Is Attempting 2nm Chips With Zero Mass-Production Experience - XenoSpectrum
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xenospectrum.com 2026-08-29
Rapidus is attempting to develop 2nm chips without any mass-production experience, sparking widespread skepticism. Despite never operating a semiconductor fabrication line, the company aims to compete with industry leaders like TSMC, Samsung, and Intel at the cutting-edge 2nm node. This ambitious pl
Semiconductor Manufacturing2nm ProcessJapan Semiconductor IndustryGovernment SupportRapidusTSMCTechnology TransferIndustrial Policy
2026-08-28
SK hynix Breaks Ground on First US HBM Packaging Plant, Targets Late 2029 Mass Production - XenoSpectrum
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xenospectrum.com 2026-08-28
2026-08-27
Fujitsu's MONAKA: A 144-Core 3D-Stacked CPU That Reserves 2nm Only for Compute - XenoSpectrum
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xenospectrum.com 2026-08-27
2026-08-27
Micron: HBM3E Consumes 3x More Wafer Capacity Than DDR5, and the Gap Will Widen - XenoSpectrum
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xenospectrum.com 2026-08-27
2026-08-27
NVIDIA Unveils NVHBM, a Custom HBM Design Claiming Up to 30% More Bandwidth - XenoSpectrum
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xenospectrum.com 2026-08-27
2026-08-26
RIKEN Team Raises EUV Laser Conversion Efficiency 40% With Dual-Beam Method, Tackling Chipmaking's Power Problem - XenoSpectrum
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xenospectrum.com 2026-08-26
2026-08-26
SiFive Launches 32-Core RISC-V Development Server to Speed Up Datacenter Porting - XenoSpectrum
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xenospectrum.com 2026-08-26