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Singapore PUB channels S$12 million to develop water efficiency solutions for wafer fabrication, data centres: DPM Gan The data centre and chipmaking industries are water-intensive and provide critical components and services for artificial intelligence. A file photo of an employee walking through a data centre. (Photo: REUTERS/Priyanshu Singh) Listen 5 min New: You can now listen to articles.

From Forge Nano Jun 12 2026 Forge Nano, Inc., a leading U.S. based semiconductor equipment and advanced materials company pioneering Atomic Layer Deposition ("ALD") technology for artificial intelligence ("AI")-era chip manufacturing and defense battery applications, which has signed an agreement to merge with Archimedes Tech SPAC Partners II Co. ("Archimedes II"), today announced that a leading

India's semiconductor push is creating an opening for companies outside the traditional chipmaking chain, including advanced materials suppliers that could serve electronics, sensor, battery, and semiconductor-related applications before the country's own wafer fabrication ecosystem matures.

Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry point into the chip supply chain while wafer fabrication remains a long-term goal. Officials said packaging activities are already underway, as Indian states used Computex in Taipei to attract Taiwanese electronics and AI supply chain investment.

InchFab's mini fabs are cost-competitive with larger 8-inch wafer fabs at the half-micron and larger nodes.

Wah Lee Industrial said it has formally moved into investments in standard gases and other supplies needed by wafer fabs, with its Tainan logistics center set to open in the second half of 2026 to support future growth. Chairman Gary Chang also confirmed that the company will pass on higher costs for semiconductor and PCB products quarterly as raw material prices climb.

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