Semiconductor News & Analysis Feed

On June 19, 2026, the District Court of Munich, Germany (Landgericht München I), ruled in favor of Infineon Technologies in two additional patent infringement cases involving gallium nitride (GaN) technology against Innoscience. The ruling prohibits Innoscience from manufacturing, selling, or market

On June 9, 2026, Vietnamese robotics company VinRobotics and global semiconductor leader Infineon Technologies AG signed a Memorandum of Understanding (MoU) to advance core technologies for next-generation robotics. This strategic collaboration marks a significant step in VinRobotics' efforts to bui

Siemens and Infineon have advanced their collaboration in silicon carbide (SiC) technology, aiming to enhance the efficiency and reliability of power systems. As part of this partnership, Infineon will supply SiC power modules to Siemens for use in its Sentron 3QD2 semiconductor circuit breakers, im

SK hynix has launched its iHBM (integrated high-bandwidth memory) solution to address thermal challenges in next-generation AI memory chips. As demand for AI and high-performance computing grows, HBM technology advances toward higher stacking and faster speeds, intensifying heat dissipation issues.