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Trending Technologies
EDA4 Mixture of Experts (MoE)2 Adreno GPU2 Hexagon NPU2 Adreno Neural Fusion2 Chiplet2 DRAM2 Memory Chips2 Blackwell2 3D NAND2 Flash Memory2 Bluetooth 6.02
2026-09-23
TSMC opens easier access for chip startups via imec's IC-Link - IO+
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ioplus.nl 2026-09-23
2026-09-18
IonQ and Synopsys Accelerate CAE Computer-Aided Engineering Workloads by 14.6% via Trapped-Ion Hardware - Quantum Computing Report
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quantumcomputingreport.com 2026-09-18
2026-09-17
NVIDIA DLSS 5 Neural Rendering Now Runs in a Web Browser Via WebGPU - TechPowerUp
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www.techpowerup.com 2026-09-17
2026-09-17
onsemi - Via Ritzau
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via.ritzau.dk 2026-09-17
2026-09-17
onsemi - Via Ritzau
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via.ritzau.dk 2026-09-17
2026-09-16
SK Hynix in Talks to Produce Memory Chips in the U.S. for the First Time via Intel's Ohio Fab - finance.biggo.com
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finance.biggo.com 2026-09-16
2026-09-16
Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges
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digitimes.com 2026-09-16
2026-09-15
Signaloid joins Open Chiplet Atlas Alliance and Announces Plans to Make Its UxHw ASICs Available via OCA Ecosystem - AiThority
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aithority.com 2026-09-15
2026-09-15
Signaloid joins Open Chiplet Atlas Alliance and Announces Plans to Make Its UxHw ASICs Available via OCA Ecosystem - Business Wire
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news.google.com 2026-09-15
2026-09-15
Signaloid joins Open Chiplet Atlas Alliance and Announces Plans to Make Its UxHw ASICs Available via OCA Ecosystem - Yahoo Finance Singapore
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sg.finance.yahoo.com 2026-09-15
2026-09-13
Semiconductor patent rankings; China IP Forum; Samsung SDI strategy; Via Licensing DRAM pool launch; ETSI director-general keynote; plus much more - IAM Patent
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www.iam-media.com 2026-09-13
2026-09-11
Kepler Computing Unveils EUV-Free Ferroelectric AI Memory, Targeting 10x HBM Capacity via 28nm Fab Retrofits - XenoSpectrum
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xenospectrum.com 2026-09-11
Kepler Computing unveiled a novel ferroelectric AI memory technology on September 9, 2026, targeting the memory bottlenecks in current AI infrastructure. By combining ferroelectric materials with 3D stacking, the company achieves up to 10x the capacity of HBM without relying on advanced EUV lithogra
Ferroelectric MemoryAI MemoryEUV LithographySemiconductor Manufacturing28nm ProcessHBMMemory TechnologyChip Fabrication
2026-09-05
Final Trades: FTAI Aviation, KLA Corp, Nvidia and Oracle - CNBC
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www.cnbc.com 2026-09-05
2026-09-02
TSMC (NYSE: TSM) VP adds 8,175 shares via no-cash award vesting - Stock Titan
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news.google.com 2026-09-02
2026-08-28
Reports: US investigates possible semiconductor smuggling via K+N’s Apex - Air Cargo News
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www.aircargonews.net 2026-08-28
2026-08-28
Apple M6’s Only Significance Is That It Validates TSMC’s 2nm Process, But As Far As Commercial Viability Goes, The A20 Pro Launch Holds More Weight - Wccftech
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wccftech.com 2026-08-28
2026-08-25
IAR Partners with Neusoft Reach to Bridge RISC-V Automotive-Grade Ecosystem via Software Toolchain - finance.biggo.com
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finance.biggo.com 2026-08-25
2026-08-19
Chinese AI firms accessing banned Nvidia chips via Southeast Asia - qz.com
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qz.com 2026-08-19
2026-08-12
Zacks Investment Ideas feature highlights: Archer Aviation, Boeing, Palantir, NVIDIA, SpaceX and United Airlines - Yahoo Finance
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news.google.com 2026-08-12
2026-08-10
Apple, Micron, SpaceX, Berkshire, Intel, AbCellera, Archer Aviation, and More Stocks That Explain Today’s Market - Barron's
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news.google.com 2026-08-10