Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

Geckos' vacuum printing copper paste technology directly addresses the filling challenges posed by shrinking glass via holes in advanced packaging. This innovation will reshape the interconnection manufacturing process, pushing upstream material and equipment vendors to accelerate iterations, while downstream foundries may see improved yield and cost reduction. From a geopolitical perspective, this breakthrough could reduce reliance on certain overseas supply chains, especially amid intensified U.S.-China tech rivalry. Competitors may respond by investing in traditional filling method enhancements or exploring alternative materials. Over the next 12-24 months, if the process achieves mass production validation, it will accelerate packaging density in high-performance computing and AI chips, forcing the entire industry to evolve toward higher integration levels and establishing new technical barriers.