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ASIA China’s Huawei touts chip design breakthrough in bid to defy U.S. sanctions The tech giant said Monday that it had achieved a breakthrough that would allow it to make cutting-edge chips within five years. Listen to this article with a free account 00:00 06:04 1x Huawei stand at the Shanghai New International Expo Centre, China, in 2025.Ying Tang / NurPhoto via Getty Images SHARE ADD NBC NEWS

The U.S. sanctions may have closed Huawei’s trading capabilities with other countries to obtain access to the latest lithography and paraphernalia associated with mass producing next-generation chips, but what it also did was fuel the company’s desire to carve its mark without relying on overseas firms. Today, Huawei announced that by 2031, it will have chips with a manufacturing process equivalen

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SHANGHAI/BEIJING – Huawei Technologies said on Monday its high-end chips will have transistor density equivalent to 1.4-nanometer processes in five years, underscoring Beijing’s efforts to neutralize U.S. sanctions that have made it hard for China to build advanced chips. Huawei did not provide independent performance data, but ​the target, unveiled at a semiconductor symposium in Shanghai, is