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2026-07-18
New Material Beats Copper’s Thermal Conductivity
0.92
eetimes.com
2026-07-18
Meet θ-TaN, a metal that moves heat nearly 3× better than copper—and could upend chip cooling layers.
Thermal Management
Semiconductor Materials
Thermal Conductivity
Copper Replacement
Chip Cooling
Materials Science
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Electronic Devices
1