Semiconductor News & Analysis Feed

20 articles

2026-11-13

Nvidia's roadmap is set through 2028, but its tempo, talent bench were built around Huang

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digitimes.com 2026-11-13

2026-11-04

Taiwan’s AI Expansion Hinges on Systems Talent and Advanced Packaging - EE Times Asia

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news.google.com 2026-11-04

2026-11-02

Weekly news roundup: Taiwan debates talent distribution; SK Hynix looks beyond HBM

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digitimes.com 2026-11-02

2026-10-20

Zhen Ding launches PCB talent development platform with National Central University, partners

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digitimes.com 2026-10-20

2026-10-02

China chip talent tensions surface in Cambricon's US$4.15 billion ex-CTO dispute

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digitimes.com 2026-10-02

2026-10-01

SG Semiconductor builds brand and talent for Singapore chip industry

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digitimes.com 2026-10-01

2026-09-29

Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal - digitimes

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www.digitimes.com 2026-09-29

The Innovate Together 2026 conference in Singapore highlights a pivotal inflection point in semiconductor packaging: the industry's center of gravity is shifting from discrete chip performance to system-level integration. As AI workloads demand unprecedented bandwidth and compute density, advanced p

Advanced Packaging System Integration AI Chips Semiconductor Talent Singapore Chip Manufacturing Packaging Technology Industry-Academia Collaboration

2026-09-28

India roundup: India's tech ambitions widen from electronics manufacturing to chips, cloud and talent

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digitimes.com 2026-09-28

2026-09-23

Taiwan courts Indian IIT chief in bid to boost chip talent ties

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digitimes.com 2026-09-23

2026-09-22

Infineon plans to further expand its India workforce, sees country as a ‘huge talent pool’: CMO - CNBC TV18

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