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2026-06-09
ROHM launches top-cooled TSC3PAK SiC MOSFET package - Bisinfotech
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www.bisinfotech.com 2026-06-09 Bisinfotech
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SiC MOSFETPower SemiconductorPackage TechnologyROHMElectric VehicleAutomotive ElectronicsPower DeviceSemiconductor Packaging
2026-06-09
ROHM TSC3PAK SiC MOSFET Package Enables High-Efficiency Power Design for EVs - Electronics Media
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www.electronicsmedia.info 2026-06-09 Electronics Media
ROHM TSC3PAK SiC MOSFET Package Enables High-Efficiency Power Design for EVs By Electronics Media - June 9, 2026 Share on Facebook Tweet on Twitter ROHM TSC3PAK SiC MOSFET Package – ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product
SiC MOSFETElectric VehiclesPower DevicesPackage TechnologyROHMAutomotive ElectronicsPower ManagementHigh-Efficiency Design