Semiconductor News & Analysis Feed
3799 articles
2026-05-27
digitimes.com
2026-05-27
Printed circuit board (PCB) drill bit manufacturer Topoint Technology approved a private placement of unsecured convertible corporate bonds with a maximum issuance amount of NT$600 million (approx. US$19.10 million) at its shareholders' meeting on May 26. The company also welcomed Unimicron Technology, Gold Circuit Electronics (GCE), and Zhen Ding Technology Group (ZDT) as strategic investors.
2026-05-27
digitimes.com
2026-05-27
Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to hold a company-wide communication meeting on the morning of May 27, during which chairman C.C. Wei is expected to explain in person the latest employee bonus policy, following online backlash over reports that the company will cut employee bonuses by 15%.
2026-05-27
digitimes.com
2026-05-27
Qualcomm has reached a deal to supply AI data center chips to ByteDance, giving the US smartphone processor designer a potentially high-volume customer as it tries to expand into AI infrastructure and custom silicon.
2026-05-27
eetimes.com
2026-05-27
Gary Hilson
University of Saskatchewan will leverage quantum computing for health, defense, energy, and agriculture research.
2026-05-27
digitimes.com
2026-05-27
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
2026-05-27
www.digitimes.com
2026-05-27
digitimes
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
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2026-05-27
www.digitimes.com
2026-05-27
digitimes
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's...
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2026-05-27
www.digitimes.com
2026-05-27
digitimes
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
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2026-05-27
aijourn.com
2026-05-27
The AI Journal
BILLERICA, Mass. & TOKYO–(BUSINESS WIRE)–Entegris, Inc. (Nasdaq: ENTG), a global leader in advanced materials and purity solutions for the semiconductor industry, and JSR Corporation, a materials innovation leader and the parent company of Inpria Corporation, today announced entry into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet
2026-05-27
www.gurufocus.com
2026-05-27
GuruFocus
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2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.stocktitan.net
2026-05-27
Stock Titan
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2026-05-27
news.google.com
2026-05-27
Business Wire
2026-05-27
www.techspot.com
2026-05-27
TechSpot
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2026-05-27
eetimes.com
2026-05-27
The most important takeaway everyone missed at the 2026 Google I/O Conference.
2026-05-27
developer.nvidia.com
2026-05-27
NVIDIA Developer
NVIDIA CUDA 13.3 brings new capabilities and performance optimizations to developers across the CUDA ecosystem. The launch of NVIDIA CUDA Tile programming in C++, enables high-level, tile-based kernel development that automatically manages complex low-level GPU details for optimal performance and portability. Additionally, CUDA Tile programming is now supported on Compute Capability 9.0 (NVIDIA Ho
2026-05-27
www.ibtimes.com
2026-05-27
International Business Times
By
Merin Rebecca Thomas
Published 05/26/26 AT 5:55 PM EDT
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ByteDance plans to purchase millions of Qualcomm application-specific integrated circuits, or ASICs, to support its AI agent software and broader artificial intelligence operations. AFP
Qualcomm has secured a deal to supply artificial intelligence ch
2026-05-27
developer.nvidia.com
2026-05-27
NVIDIA Developer
Developers can now use NVIDIA CUDA Tile programming within large existing C++ GPU codebases to develop highly optimized GPU kernels using tile-based abstractions.
NVIDIA CUDA Tile, launched with NVIDIA CUDA 13.1, introduced tile-based programming for GPUs. Designed with a top-level language layer and another intermediate layer that any high-level programming language can target, CUDA Tile autom
2026-05-27
mexicobusiness.news
2026-05-27
Mexico Business News
Micron Technology reached a US$1 trillion market valuation for the first time on May 26 after its shares surged nearly 20% during trading, highlighting the growing importance settling up 17.4% at US$881.60, extending a rally that has made Micron one of the semiconductor industry’s strongest performers over the past year.
The increase followed UBS raising its price target on Micron shares from US$
2026-05-27
blogs.nvidia.com
2026-05-27
NVIDIA Blog
NVIDIA Vera CPU Is ‘Packing a Heavy-Hitting Punch’ Against Competition
In the new Phoronix benchmark, Vera delivers winning performance and memory results for agentic AI.
May 26, 2026 by Diana Aung
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The shift to agentic AI creates a new CPU requirement for the AI factory: fast cores, massive memory bandwidth and the ability to sustain high performance when all cores are active.
Initial