Semiconductor News & Analysis Feed
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2026-05-27
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2026-05-27
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2026-05-27
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2026-05-27
siliconangle.com
2026-05-27
SiliconANGLE
Memory chip makers Micron Technology Inc. and SK Hynix Inc. saw their market values surge above $1 trillion for the first time today, driven by insatiable demand for their products from artificial intelligence firms.
Micron’s stock was up more than 19% today, as investors piled into the stock following a report from the investment bank UBS, which tripled its price target from $535 to $1,525 per s
2026-05-27
www.investing.com
2026-05-27
Investing.com
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2026-05-27
www.cnbc.com
2026-05-27
CNBC
Shares of SK Hynix jumped more than 11% on Wednesday, lifting the South Korean chipmaker’s market capitalization above $1 trillion as investors continued to pile into artificial intelligence-linked semiconductor stocks.
The rally extended a blistering run that has already seen SK Hynix shares skyrocket about 250% since the start of the year, fueled by surging demand for high-bandwidth memory chip
2026-05-27
www.reuters.com
2026-05-27
Reuters
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2026-05-27
www.geneonline.com
2026-05-27
geneonline.com
Entegris and JSR Corporation/Inpria Corporation announced a non-exclusive cross-licensing agreement pertaining to extreme ultraviolet (EUV) lithography. The agreement involves the licensing of intellectual property related to EUV lithography technology.
The cross-licensing agreement allows both companies to utilize each other’s patents in the field of EUV lithography. This arrangement is non-excl
2026-05-27
cryptobriefing.com
2026-05-27
Crypto Briefing
TSMC plans price hikes for advanced chips starting 2026, squeezing AI hardware costs
The world's most important chipmaker is raising prices on its cutting-edge manufacturing nodes, and the ripple effe
2026-05-27
digitimes.com
2026-05-27
The world's largest chip designers are steadily growing more bullish on the future of cloud artificial intelligence (AI) chips known as ASICs (application-specific integrated circuits) — a market increasingly seen as the next major battleground in the global AI boom.
2026-05-27
digitimes.com
2026-05-27
SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for short-reach AI cluster links. The collaboration could accelerate the commercialization of Micro LED co-packaged optics (CPO) technology and strengthen China's role in global AI infrastructure supply chains, according to
2026-05-27
digitimes.com
2026-05-27
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
2026-05-27
digitimes.com
2026-05-27
Kinpo Electronics outlined its 2026 core strategy at a shareholders' meeting on May 25, centering on "bearing fruit" as it builds on years of product-mix adjustments, expands into AI-related products, and accelerates its shift toward an ODM model.
2026-05-27
digitimes.com
2026-05-27
Taiwan-based Daxin Materials posted stronger revenue and profitability in 2025 as rapid growth in semiconductor materials offset a still-cautious display market recovery, with AI- and HPC-driven demand emerging as the company's primary growth engine.
2026-05-27
digitimes.com
2026-05-27
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
2026-05-27
digitimes.com
2026-05-27
Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to hold a company-wide communication meeting on the morning of May 27, during which chairman C.C. Wei is expected to explain in person the latest employee bonus policy, following online backlash over reports that the company will cut employee bonuses by 15%.
2026-05-27
eetimes.com
2026-05-27
Gary Hilson
University of Saskatchewan will leverage quantum computing for health, defense, energy, and agriculture research.
2026-05-27
semiengineering.com
2026-05-27
Gregory Haley
As high-NA EUV approaches, mask makers need new metrics, model-based checks, and curvil...
2026-05-27
digitimes.com
2026-05-27
Printed circuit board (PCB) drill bit manufacturer Topoint Technology approved a private placement of unsecured convertible corporate bonds with a maximum issuance amount of NT$600 million (approx. US$19.10 million) at its shareholders' meeting on May 26. The company also welcomed Unimicron Technology, Gold Circuit Electronics (GCE), and Zhen Ding Technology Group (ZDT) as strategic investors.