Semiconductor News & Analysis Feed
1277 articles
2026-06-25
www.msn.com
2026-06-25
MSN
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2026-06-25
simplywall.st
2026-06-25
simplywall.st
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TSX:HBM
Hudbay Minerals (TSX:HBM) Completes Arizona Sonoran Copper Deal To Build U.S. Copper Pipeline
June 25, 2026
Simply Wall St
Reviewed by
Bailey Pemberton
Hudbay Minerals (TSX:HBM) has completed its acquisition of Arizona Sonoran Copper Company.
The deal combines Hudbay’s Copper World project with the Cactus copper project in Arizona.
The transaction creates a lar
2026-06-25
www.igorslab.de
2026-06-25
igor´sLAB
LATEST NEWS
ASE is building 15 new sites: Advanced Packaging is becoming the next major AI bottleneck
25. June 2026 06:00Samir Bashir
📖 Reading time: approx. 9 minutes · 1,647 words · 10,736 characters
In the case of AI chips, people like to talk about transistors, HBM bandwidth, and compute performance. Eventually, however, the GPU, memory, chiplets, and power supply must actually be assembled i
2026-06-25
biz.chosun.com
2026-06-25
Chosunbiz
By
Jeong Du-yong
Published 2026.06.25. 12:34
Global DRAM market share trend. /Courtesy of Counterpoint Research
In the global memory market, Samsung Electronics kept the No. 1 spot in DRAM and NAND flash. SK hynix maintained the lead in the high bandwidth memory (HBM) market with a majority share. Chinese companies increased their shares in DRAM and NAND, speeding up the chase.
According to mem
2026-06-25
www.investing.com
2026-06-25
Investing.com
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2026-06-25
digitimes.com
2026-06-25
IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan, Europe, and the US say the shortage is worse than expected, pushing packaging, testing, and related materials into broader supply constraints.
2026-06-25
digitimes.com
2026-06-25
Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from devices to cloud infrastructure, a move that could affect developers and enterprises worldwide. The collaboration aims to simplify AI deployment across the compute continuum while enabling faster, more flexible, and more scalable hybrid AI applications.
2026-06-25
digitimes.com
2026-06-25
The European Commission has given the green light to a EUR76 million (approx. US$86.3 million) German subsidy supporting QuantumDiamonds' plan to build a new semiconductor testing equipment facility in Munich, the Commission announced. The approval is the latest step in Brussels' push to reduce Europe's reliance on foreign chip technology and strengthen its industrial autonomy.
2026-06-25
digitimes.com
2026-06-25
Kioxia is preparing to enter the US capital market through American depositary shares (ADS) in the first quarter of fiscal 2027, just as its latest annual report points to accelerating demand for NAND flash memory, SSDs and next-generation storage used in AI and consumer electronics.
2026-06-25
digitimes.com
2026-06-25
SK Group chairman Chey Tae-won is planning to meet Tesla and SpaceX leadership in the US at the end of June 2026 to advance cooperation on next-generation AI infrastructure, memory supply, and data-center projects, South Korean outlet Ddailyreported, citing industry sources. The meeting is expected to cover specific business collaboration plans with Tesla, SpaceX, and xAI, though the exact date wa
2026-06-25
digitimes.com
2026-06-25
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the g
2026-06-25
digitimes.com
2026-06-25
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to divers
2026-06-25
digitimes.com
2026-06-25
Sigurd is expanding testing and packaging capacity as AI demand and steady customer orders keep its facilities fully utilized. For global readers, the move underscores how supply chains for silicon photonics (SiPh), AI servers, and advanced chips are tightening, while new capacity is expected to ease bottlenecks and shape revenue growth in 2026 and 2027.
2026-06-25
digitimes.com
2026-06-25
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.
2026-06-25
digitimes.com
2026-06-25
Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations, as cumulative revenue from the company's latest HBM generation has crossed the US$1 billion mark and demand tied to AI chips continues to rise.
2026-06-25
www.azfamily.com
2026-06-25
AZ Family
Scottsdale man sentenced for conspiracy to steal semiconductor testing trade secrets
An Israeli citizen living in Scottsdale has been sentenced in a case involving the theft of a Valley company’s trade secrets.
By Ryan McCoy
Published: Jun. 25, 2026 at 7:03 AM GMT+8|Updated: 3 hours ago
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SCOTTSDALE, AZ (AZFamily) — An Israeli citizen living in Sc
2026-06-25
www.investing.com
2026-06-25
Investing.com
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2026-06-25
www.qualcomm.com
2026-06-25
Qualcomm
Qualcomm Incorporated (NASDAQ: QCOM), a connected computing leader at the center of the AI era, today outlined the acceleration of its diversification strategy and unveiled its comprehensive strategy for the data center, marking its next phase of growth across every tier of the compute continuum, at its 2026 Investor Day.
“We are defining Qualcomm’s next chapter as we accelerate our edge diversi
2026-06-25
investor.qualcomm.com
2026-06-25
Qualcomm
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2026-06-25
www.investing.com
2026-06-25
Investing.com
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